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Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform

New Tensilica AI engine boosts performance and AI accelerators provide a turnkey solution for consumer, mobile, automotive and industrial AI SoC designs Highlights: Domain-specific, extensible and configurable AI platform built upon mature, volume production-proven Tensilica architecture Industry-leading performance and energy efficiency for on-device AI applications Comprehensive, common AI software addresses all target markets Low-, mid- […]

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Teledyne e2v Introduces the Industry’s Smallest 2MP & 1.5MP CMOS Sensors, Featuring a Low-noise Global Shutter Pixel

New Topaz sensors are ideal for mobile applications, offering an attractive price point with no-compromise performance. Grenoble, FRANCE, September 14, 2021 – Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY], has introduced its Topaz series of industrial CMOS sensors with new 2MP and 1.5MP resolution devices. These new 1920 x 1080 and 1920 x

Teledyne e2v Introduces the Industry’s Smallest 2MP & 1.5MP CMOS Sensors, Featuring a Low-noise Global Shutter Pixel Read More +

Webinar Explores Building Scalable Edge ML Solutions Using NXP Processors and Amazon Services

Now available for on-demand viewing is the archive recording of the webinar “Building Scalable Edge ML Solutions with NXP i.MX Applications Processors and AWS Cloud Services,” co-presented by Ali Osman Örs, Director of AI ML Strategy and Technologies for Edge Processing at NXP Semiconductors, and Jack Ogawa, responsible for Strategic Semiconductor Partnerships for IoT at

Webinar Explores Building Scalable Edge ML Solutions Using NXP Processors and Amazon Services Read More +

Xilinx Showcases New Solutions and Technologies for Software and Hardware Developers

Week one unveils software developer kit for intelligent video analytics applications, an expanded video and imaging IP portfolio and developer design contest Sep 07, 2021 – SAN JOSE, Calif. – (Xilinx Adapt) – Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive computing, today unveiled powerful new solutions and IP for its rapidly growing software, AI, and

Xilinx Showcases New Solutions and Technologies for Software and Hardware Developers Read More +

MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks

Kompanio family allows OEMs to build powerful, thin and lightweight mobile computing devices with long battery life HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanioâ„¢ 900T chipset, expanding MediaTek’s portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch

MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks Read More +

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications

Geneva, September 9, 2021 – STMicroelectronics has announced the first multi-zone FlightSense™ time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products. The VL53L5CX sensor provides up to 64 sensing zones with multi-target detection, distance measurement up to four meters in each zone, and

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications Read More +

BrainChip Demonstrates that Intelligent AI is Everywhere at AI Hardware Summit 2021

Aliso Viejo, Calif. – August 5, 2021 – BrainChip Holdings Ltd (ASX: BRN), (OTCQX: BRCHF), a leading provider of ultra-low power high performance artificial intelligence technology, today announced that Rob Telson, VP Worldwide Sales and Marketing, will be a featured presenter at the AI Hardware Summit at 1:25 p.m. PDT, September 13th. This hybrid event

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Efinix Announces AEC-Q100 Qualification and Automotive Product Line Initiative

September 08, 2021–SANTA CLARA, Calif.–(BUSINESS WIRE)–Efinix®, an innovator in programmable product platforms and technology, today announced AEC-Q100 qualification for several members of its popular Trion® line of FPGAs and a major initiative to extend both its Trion and Titanium product lines into automotive markets. The first products to be released with AEC-Q100 qualification are the

Efinix Announces AEC-Q100 Qualification and Automotive Product Line Initiative Read More +

FRAMOS Showcases ToF, SWIR, and GMSL2 Among Other Leading Edge Technologies and Live Demos at the Vision Show 2021

Munich, September 6, 2021 – At VISION 2021, FRAMOS, a leading global imaging provider, will be presenting its imaging and embedded vision portfolio while educating vision users on the latest advances in Embedded Vision and 3D technology and providing practical solutions to industry-specific challenges. This is a great time to come and celebrate FRAMOS’s 40th

FRAMOS Showcases ToF, SWIR, and GMSL2 Among Other Leading Edge Technologies and Live Demos at the Vision Show 2021 Read More +

FRAMOS Announcement: Intel RealSense Discontinues LiDAR, Facial-Authentication and Tracking Product Lines, Focuses on Stereo Vision

Munich, September 2, 2021 – Intel RealSense has decided to refocus their business model and, in doing so, have discontinued their L515 LiDAR and the Facial Authentication (FA) product lines to focus on their existing D400 series Stereo Vision product line. The same great camera products, like the D415, D435, D435i, and D455 will continue

FRAMOS Announcement: Intel RealSense Discontinues LiDAR, Facial-Authentication and Tracking Product Lines, Focuses on Stereo Vision Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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