Videos

Liran Bar, Director of Product Marketing at CEVA, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Bar demonstrates computer and vision technology in the form of the latest iCatchtek V50 chip, powered by CEVA's vision processor and running real-time multi-exposure HDR (high dynamic range) functions.

Karl Roman, Project Lead for Advanced Driver Assist Systems at HELLA Aglaia, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Roman demonstrates front camera solutions co-developed with Texas Instruments. HELLA Aglaia's industry-leading forward vision solutions run on TI’s Jacinto™ TDA2Plus SoCs to meet NCAP-2020-compliant front cameras.

Liran Bar, Director of Product Marketing at CEVA, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Bar demonstrates computer and vision technology in the form of the Wunder360 C1, a commercially available 360 degree device that incorporate Rockchip's RV1108 chip powered by the CEVA-XM4 vision processor.

Peter Labaziewicz, Director of Engineering for Vision and Imaging at Texas Instruments, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Labaziewicz demonstrates how Texas Instruments' TDA3x processors use an integrated image signal processor to help camera monitoring systems see better under a variety of conditions, allowing

Liran Bar, Director of Product Marketing at CEVA, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Bar demonstrates image enhancement technology as exemplified by commercially available smartphones that incorporate a standalone pre-ISP chip to enhance the overall image quality. The fundamental OEM motivation is to reduce

Pulin Desai, Product Marketing Director at Cadence, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Desai demonstrates the company’s Tensilica® Vision P6 DSP, integrated in a 22nm FDSOI process-based SoC, generating a stitched top-view of images captured by four cameras on an automobile, using lens distortion

Dan Wang, Assistant Engineer at Texas Instruments, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Wang demonstrates Texas Instruments' AWR1x mmWave radar sensors, which provide high-accuracy sensing for ADAS applications, regardless of lighting, weather, etc. As a complement to traditional camera-based vision technologies, these sensors provide

Liran Bar, Director of Product Marketing at CEVA, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Bar demonstrates Brodman17's real-time face detection and tracking neural network running on a FPGA-based CEVA-XM4 vision processor at 60 MHz. A production ASIC-based implementation will run above 800 MHz. The

Pulin Desai, Product Marketing Director at Cadence, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Desai demonstrates the company’s Tensilica® Vision P6 DSP in an on-device AI (artificial intelligence) application. A 22nm FDSOI process-based SoC that integrates the Vision P6 is processing code for image classification,

Kyle Fox, Director of i.MX8 Applications Processors at NXP Semiconductors, demonstrates the company's latest embedded vision technologies and products at the January 2018 Consumer Electronics Show. Specifically, Fox demonstrates NXP's scalable AI at the edge, in partnership with Au-Zone Technologies and extending from low cost MCUs to high-end application processors.