Joint silicon development through SiFive's DesignShare Program combines IP and design strengths of both companies to develop Edge AI SoCs for a range of high-volume end markets including smart home, automotive, robotics, security, augmented reality, industrial and IoT
SAN MATEO and MOUNTAIN VIEW, Calif., Jan. 7, 2020 /PRNewswire/ — SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions and CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced a new partnership to enable the design and creation of ultra-low-power domain-specific Edge AI processors for a range of high-volume end markets. The partnership, as part of SiFive's DesignShare program, is centered around RISC-V CPUs, CEVA's DSP cores, AI processors and software, which will be designed into SoCs targeting an array of end markets where on-device neural networks inferencing supporting imaging, computer vision, speech recognition and sensor fusion applications is required. Initial end markets include smart home, automotive, robotics, security and surveillance, augmented reality, industrial and IoT.
Machine Learning Processing at the Edge
Domain-specific SoCs which can handle machine learning processing on-device are set to become mainstream, as the processing workloads of devices increasingly includes a mix of traditional software and efficient deep neural networks to maximize performance, battery life and to add new intelligent features. Cloud-based AI inference is not suitable for many of these devices due to security, privacy and latency concerns. SiFive and CEVA are directly addressing these challenges through the development of a range of domain-specific scalable edge AI processor designs, with the optimal balance of processing, power efficiency and cost.
The Edge AI SoCs are supported by CEVA's award-winning CDNN Deep Neural Network machine learning software compiler that creates fully-optimized runtime software for the CEVA-XM vision processors, CEVA-BX audio DSPs and NeuPro AI processors. Targeted for mass-market embedded devices, CDNN incorporates a broad range of network optimizations, advanced quantization algorithms, data flow management and fully-optimized compute CNN and RNN libraries into a holistic solution that enables cloud-trained AI models to be deployed on edge devices for inference processing. CEVA will also supply a full development platform for partners and developers based on the CEVA-XM and NeuPro architectures to enable the development of deep learning applications using the CDNN, targeting any advanced network, as well as DSP tools and libraries for audio and voice pre- and post-processing workloads.
SiFive DesignShare Program
The SiFive DesignShare IP program offers a streamlined process for companies seeking to partner with leading vendors to provide pre-integrated premium Silicon IP for bringing new SoCs to market. As part of SiFive's business model to license IP when ready for mass production, the flexibility and choice of the DesignShare IP program reduces the complexities of contract negotiation and licensing agreements to enable faster time to market through simpler prototyping, no legal red tape, and no upfront payment.
"CEVA's partnership with SiFive enables the creation of Edge AI SoCs that can be quickly and expertly tailored to the workloads, while also retaining the flexibility to support new innovations in machine learning," said Issachar Ohana, Executive Vice President, Worldwide Sales at CEVA. "Our market leading DSPs and AI processors, coupled with the CDNN machine learning software compiler, allow these AI SoCs to simplify the deployment of cloud-trained AI models in intelligent devices and provides a compelling offering for anyone looking to leverage the power of AI at the edge."
"Enabling future-proof, technology-leading processor designs is a key step in SiFive's mission to unlock technology roadmaps," said Dr. Naveed Sherwani, president and CEO, SiFive. "The rapid evolution of AI models combined with the requirements for low power, low latency, and high-performance demand a flexible and scalable approach to IP and SoC design that our joint CEVA / SiFive portfolio is superbly positioned to provide. The result is shorter time-to-market, while lowering the entry barriers for device manufacturers to create powerful, differentiated products."
Availability
SiFive's DesignShare program, including CEVA-BX Audio DSPs, CEVA-XM Vision DSPs and NeuPro AI processors, is available now. Visit www.sifive.com/designshare for more information.
About SiFive
SiFive is on a mission to free semiconductor roadmaps and declare silicon independence from the constraints of legacy ISAs and fragmented solutions. As the leading provider of market-ready processor core IP and silicon solutions based on the free and open RISC-V instruction set architecture SiFive helps SoC designers reduce time-to-market and realize cost savings with customized, open-architecture processor cores, and democratizes access to optimized silicon by enabling system designers in all markets to build customized RISC-V based semiconductors. Founded by the inventors of RISC-V, SiFive has 16 design centers worldwide, and has backing from Sutter Hill Ventures, Qualcomm Ventures, Spark Capital, Osage University Partners, Chengwei, Huami, SK Hynix, Intel Capital, and Western Digital. For more information, please visit www.sifive.com.
Stay current with the latest SiFive updates via LinkedIn, Twitter, Facebook, and YouTube.
About CEVA, Inc.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies. We offer Digital Signal Processors, AI processors, wireless platforms and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence, all of which are key enabling technologies for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial and IoT. Our ultra-low-power IPs include comprehensive DSP-based platforms for 5G baseband processing in mobile and infrastructure, advanced imaging and computer vision for any camera-enabled device and audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and IMU solutions for AR/VR, robotics, remote controls, and IoT. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For wireless IoT, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT. Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube, Facebook, LinkedIn and Instagram.
