Resources
In-depth information about the edge AI and vision applications, technologies, products, markets and trends.
The content in this section of the website comes from Edge AI and Vision Alliance members and other industry luminaries.
All Resources
Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging
The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for
IDTechEx Technology Innovations Outlook 2026-2036
This collection of in-depth articles from IDTechEx industry experts examines some of the most important technology innovation trends set to transform global industries over the next decade. It provides both a clear assessment of today’s
ImagingNext 2025 Inspires the AI Vision Community: Exciting Insights, Powerful Keynote Speeches, and Valuable Contacts
Munich, Bavaria, Germany – September 25th, 2025 – This year’s ImagingNext, the leading event for AI vision and embedded imaging, was a resounding success. Around 100 participants came together to discuss the latest trends, technologies,
Introducing Modalix SoM: Power Efficient SoM with Rich Peripherals for Seamless Sensor Integration
This blog post was originally published at SiMa.ai’s website. It is reprinted here with the permission of SiMa.ai. At SiMa.ai, we’re pushing the boundaries of what’s possible with Physical AI. Today, we’re proud to announce
“Unlocking Visual Intelligence: Advanced Prompt Engineering for Vision-language Models,” a Presentation from LinkedIn Learning
Alina Li Zhang, Senior Data Scientist and Tech Writer at LinkedIn Learning, presents the “Unlocking Visual Intelligence: Advanced Prompt Engineering for Vision-language Models” tutorial at the May 2025 Embedded Vision Summit. Imagine a world where
The Edge’s Essential Role in the Future of AI
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. What you should know: The future of AI will be hybrid, with the cloud and the edge
“Deploying Accelerated ML and AI: The Role of Khronos Open Standards,” a Presentation from the Khronos Group
Neil Trevett, President of the Khronos Group and Vice President of Developer Ecosystems at NVIDIA, presents the “Deploying Accelerated ML and AI: The Role of Khronos Open Standards” tutorial at the May 2025 Embedded Vision
New Snapdragon X2 Elite Extreme and Snapdragon X2 Elite are the Fastest and Most Efficient Processors for Windows PCs
Highlights: Built for ultra-premium Windows 11 PCs, Snapdragon® X2 Elite Extreme tackles complex, expert-level workloads with ultimate performance, multi-day battery life and blazing fast AI-processing power. Snapdragon® X2 Elite drives powerful and efficient multitasking across
Snapdragon 8 Elite Gen 5, the World’s Fastest Mobile System-on-a-chip, Establishes New Consumer Experiences and Sets New Industry Benchmarks
Highlights: The 3rd Gen Qualcomm Oryon™ CPU is the fastest mobile CPU ever. With state-of-the-art performance, efficiency and on-device AI processing, Snapdragon® 8 Elite Gen 5 is purpose-built to amplify mainstay experiences and debut breakthrough
Technologies
Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging
The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036. In this new article, IDTechEx Senior Technology
IDTechEx Technology Innovations Outlook 2026-2036
This collection of in-depth articles from IDTechEx industry experts examines some of the most important technology innovation trends set to transform global industries over the next decade. It provides both a clear assessment of today’s landscape and a forward-looking outlook through to 2036, helping businesses, investors, and policymakers prepare for opportunities and challenges ahead. This
ImagingNext 2025 Inspires the AI Vision Community: Exciting Insights, Powerful Keynote Speeches, and Valuable Contacts
Munich, Bavaria, Germany – September 25th, 2025 – This year’s ImagingNext, the leading event for AI vision and embedded imaging, was a resounding success. Around 100 participants came together to discuss the latest trends, technologies, and use cases in the field of vision AI in an inspiring atmosphere. The mood was great – from the
Applications
How e-con Systems Built a Multi-camera Solution for Large Mining Vehicles to Eliminate Blind Spots
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Large mining vehicles tend to operate in unpredictable terrains. They often face issues like poor lighting or heavy dust. Find out how e-con Systems helped a client select and deploy a multi-camera solution for their
Semiconductors at the Heart of Automotive’s Next Chapter
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Automotive White Paper, Vol.2, Powered by Yole Group – Shifting gears! KEY TAKEAWAYS The automotive semiconductor market will soar from $68 billion in 2024 to $132 billion in 2030, growing at a
How Do You Teach an AI Model to Reason? With Humans
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. NVIDIA’s data factory team creates the foundation for AI models like Cosmos Reason, which today topped the physical reasoning leaderboard on Hugging Face. AI models are advancing at a rapid rate and scale. But what might they
Functions
PerCV.ai: How a Vision AI Platform and the STM32N6 can Turn Around an 80% Failure Rate for AI Projects
This blog post was originally published at STMicroelectronics’ website. It is reprinted here with the permission of STMicroelectronics. The vision AI platform PerCV.ai (pronounced Perceive AI), could be the secret weapon that enables a company to deploy an AI application when so many others fail. The solution from Irida Labs, a member of the ST
“Deep Sentinel: Lessons Learned Building, Operating and Scaling an Edge AI Computer Vision Company,” a Presentation from Deep Sentinel
David Selinger, CEO of Deep Sentinel, presents the “Deep Sentinel: Lessons Learned Building, Operating and Scaling an Edge AI Computer Vision Company” tutorial at the May 2025 Embedded Vision Summit. Deep Sentinel’s edge AI security cameras stop some 45,000 crimes per year. Unlike most security camera systems, they don’t just… “Deep Sentinel: Lessons Learned Building,
Automated Driving for All: Snapdragon Ride Pilot System Brings State-of-the-art Safety and Comfort Features to Drivers Across the Globe
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Qualcomm Technologies, Inc. introduces Snapdragon Ride Pilot at IAA Mobility 2025 What you should know: Qualcomm Technologies, Inc. has introduced Snapdragon Ride Pilot to help make driving more safety-focused and convenient for people around the world. Features
