Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s DX-V1 and DX-V3 AI vision processors.
The DX-V1 and DX-V3 are AI enabler chips for vision systems. The DX-V1 is a standalone edge AI chip that can process single vision applications such as AI security cameras, camera monitoring systems, in-cabin monitoring, and more.
The DX-V3 is an advanced AI chip for multi-vision applications like multi-directional cameras, 3D sensing and stereo cameras, and autonomous robotic platforms. One DX-V3 enables processing for up to 4 channels. By incorporating a DSP, the DX-V3 supports LiDAR, radar, and iToF sensors, enabling 3D sensing and sensor fusion capabilities crucial for autonomous mobile robots.
You can experience the DX-V1 and DX-V3 chips by applying for DEEPX’s Early Engagement Customer Program: https://deepx.ai/early-engagement-customer-program/
