Phillippe Legeard, Imaging Applications and Customer Support Engineer at STMicroelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Legeard demonstrates his company’s first 0.5 Mpixel indirect 3D time-of-flight (ToF) sensor, the VD55H1.
The low noise, low power VD55H1 die is manufactured on advanced backside-illuminated, stacked wafer technology. Get full specs and learn more at: https://www.st.com/en/imaging-and-photonics-solutions/vd55h1.html.
