Brian Dipert

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America

Lattice Semiconductor, Memory, Processors, Summit 2024, Videos /

Hussein Osman, Segment Marketing Director at Lattice Semiconductor, and Richard Crisp, Vice President and Chief Scientist at Etron Technology America, co-presents the “Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs” tutorial at the May 2024 Embedded Vision Summit. Attaining the lowest power,… “Squeezing the Last Milliwatt and […]

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America Read More +

Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024

Automotive, Cadence, News, Processors /

Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements 18 Jun 2024 – At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification

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TOPS of the Class: Decoding AI Performance on RTX AI PCs and Workstations

Blog Posts, NVIDIA, Processors /

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. What is a token? Why is batch size important? And how do they help determine how fast AI computes? Editor’s note: This post is part of the AI Decoded series, which demystifies AI by making the technology

TOPS of the Class: Decoding AI Performance on RTX AI PCs and Workstations Read More +

“Maximize Your AI Compatibility with Flexible Pre- and Post-processing,” a Presentation from Flex Logix

Flex Logix, Processors, Summit 2024, Tools, Videos /

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, presents the “Maximize Your AI Compatibility with Flexible Pre- and Post-processing” tutorial at the May 2024 Embedded Vision Summit. At a time when IC fabrication costs are skyrocketing and applications have increased in complexity, it is important to… “Maximize Your AI Compatibility with

“Maximize Your AI Compatibility with Flexible Pre- and Post-processing,” a Presentation from Flex Logix Read More +

“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence

Cadence, Processors, Summit 2024, Tools, Videos /

Amol Borkar, Product Marketing Director at Cadence, presents the “Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors” tutorial at the May 2024 Embedded Vision Summit. From ADAS to autonomous vehicles to smartphones, the number and variety of sensors used in edge devices is increasing: radar, LiDAR, time-of-flight… “Addressing Tomorrow’s Sensor Fusion and

“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence Read More +

Automotive LiDAR Deployment Ramps Up in 2024

Automotive, Market Analysis, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. More new car models with LiDAR were released in 2023 than the previous four years. Chinese players lead the game. Supplier market share in the dynamic automotive LiDAR space is changing as

Automotive LiDAR Deployment Ramps Up in 2024 Read More +

“Temporal Event Neural Networks: A More Efficient Alternative to the Transformer,” a Presentation from BrainChip

Algorithms, BrainChip, Processors, Software, Summit 2024, Tools, Videos /

Chris Jones, Director of Product Management at BrainChip, presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit. The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent… “Temporal Event Neural Networks: A

“Temporal Event Neural Networks: A More Efficient Alternative to the Transformer,” a Presentation from BrainChip Read More +

Butterfly Network’s iQ3 CMUT Sensor: The Ins and Outs

Market Analysis, Medical, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Innovative 9656 Transmitter CMUT MEMS die in Butterfly’s iQ3 handheld point-of-care ultrasound system. OUTLINE The iQ3, Butterfly Network’s third-generation CMUT sensor, received FDA clearance in January 2024 and follows the sale of

Butterfly Network’s iQ3 CMUT Sensor: The Ins and Outs Read More +

How Edge Devices Can Help Mitigate the Global Environmental Cost of Generative AI

Algorithms, Blog Posts, Processors, Qualcomm, Software, Tools /

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Exploring the role of edge devices in reducing energy consumption and promoting sustainability in AI systems The economic value of generative artificial intelligence (AI) to the world is immense. Research from McKinsey estimates that generative AI could add the

How Edge Devices Can Help Mitigate the Global Environmental Cost of Generative AI Read More +

“Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” a Presentation from BDTI

Algorithms, BDTI, Memory, Processors, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Phil Lapsley, Co-founder and Vice President of BDTI, presents the “Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!)” tutorial at the May 2024 Embedded Vision Summit. For over 30 years, BDTI has provided engineering, evaluation and advisory services to processor suppliers and companies… “Silicon Slip-ups: The Ten Most

“Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” a Presentation from BDTI Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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