Brian Dipert

Lattice Semiconductor Demonstration of a Low-latency Edge AI Sensor Bridge for NVIDIA’s Holoscan

Kambiz Khalilian, Director of Strategic Initiatives and Ecosystem Alliances for Lattice Semiconductor, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Khalilian demonstrates a low-latency edge AI sensor bridge solution for NVIDIA’s Holoscan. The Lattice FPGA-based Holoscan Sensor Bridge enables high-throughput and low-latency sensor aggregation and […]

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Lumotive Demonstration of a Sensor Hub for LiDAR, Radar and Camera Fusion

Kevin Camera, Vice President of Product for Lumotive, demonstrates the company’s latest edge AI and vision technologies and products in Lattice Semiconductor’s booth at the 2024 Embedded Vision Summit. Specifically, Camera demonstrates a sensor hub for concurrently fusing together and processing data from multiple sources: Velodyne’s VLP-16 LiDAR, Lumotive’s M30 solid state LiDAR, Texas Instruments’

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Develop Generative AI-powered Visual AI Agents for the Edge

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. An exciting breakthrough in AI technology—Vision Language Models (VLMs)—offers a more dynamic and flexible method for video analysis. VLMs enable users to interact with image and video input using natural language, making the technology more accessible and

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e-con Systems Demonstration of Its Advanced Camera Solutions

Gomathi Sankar Paramasivan, Head of the Industrial Camera Business Unit at e-con Systems, demonstrates the company’s latest edge AI and vision technologies and products in Lattice Semiconductor’s booth at the 2024 Embedded Vision Summit. Specifically, Paramasivan demonstrates his company’s CAM85_CUOAGX and See3CAM50_CUG advanced camera solutions based on Lattice Semiconductor FPGAS. The showcased cameras are powered

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Flex Logix Demonstration of Enabling High Performance AI Inference At the Edge

Jeremy Roberson, Technical Director and Software Architect for AI and Machine Learning at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Roberson demonstrates the power, performance, and area (PPA) capabilities of his company’s InferX IP by using it to run a state-of-the-art object

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Generative AI 2024 – Impact on Processors, Memory, Advanced Packaging and Substrates

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Deep dive in supply chain and its bottleneck and resilience. Which company takes benefits of generative AI and who is missing? Datacenter GPU and AI ASIC revenue could reach $156B by 2025,

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Flex Logix Overview of SoC Adaptability and Algorithm Acceleration Using Embedded FPGA Technology

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Bethurem discusses how his company’s embedded FPGA technology can bring adaptability and algorithm acceleration capabilities to SoCs. Building SoCs is becoming increasingly challenging. To create

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Flex Logix Overview of How to Enable Long-lasting Security For SoCs with Embedded FPGA Technology

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Bethurem discusses how his company’s embedded FPGA technology can enable long-lasting security for SoCs. Considering current and future security landscapes and their associated challenges, providing

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Semiconductor Technologies are Evolving to Meet Generative AI Demand

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Power and processor-hungry AI set to drive next stage of chip development – Generative artificial intelligence (AI) is redefining the value of work, and its exponential need for performance is driving demand

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DEEPX Demonstration of Its DX-M1 AIoT Booster

Taisik Won, the President of DEEPX USA, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Won demonstrates the company’s AIoT Booster, the DX-M1. The DX-M1 is DEEPX’s flagship AI chip, meticulously engineered for seamless integration into any AIoT application. This cutting-edge chip can simultaneously process

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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