Robotics

e-con Systems Launches a Ready-to-Deploy AI Vision Kit with e-con’s Sony IMX415-based 4K Camera Module, Qualcomm QCS610 SoC-based SoM, and Carrier Board

Complete AI vision solution | 4K resolution | Qualcomm® QCS610 | Sony STARVIS IMX415| MIPI CSI 2 San Jose and Chennai (April 5, 2022) – e-con Systemsâ„¢, a leading embedded camera company, launches qSmartAI80_CUQ610, a Qualcomm AI vision kit based on Sony STARVIS IMX415. This ready-to-deploy AI camera kit is suitable for running image-based machine […]

e-con Systems Launches a Ready-to-Deploy AI Vision Kit with e-con’s Sony IMX415-based 4K Camera Module, Qualcomm QCS610 SoC-based SoM, and Carrier Board Read More +

Lanner Electronics and MOV.AI Partner to Speed Up AMR Development with an Integrated Computing and Software Platform

April 5, 2022 – Lanner Electronics and MOV.AI are collaborating to provide Autonomous Mobile Robots (AMR) manufacturers with an integrated computing and software platform for optimized performance and faster AMR development and deployment. According to Fortune Business Insights, the global AMR market is expected to grow at an annual rate of 23.7 percent, reaching USD

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Immervision Launches UAV Low-light Navigation Camera Module

Immervision’s UAV Camera Module for machine perception and maximized low-light sensitivity delivers enhanced image quality MONTREAL, CANADA—March 29, 2022 – Immervision, the world’s leading developer of advanced vision systems combining optics, image processing, and sensor fusion technology, today announced the availability of its UAV (Unmanned Aerial Vehicle) Low-Light Navigation Camera Module designed for autonomous and semi-autonomous

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NVIDIA Announces Availability of Jetson AGX Orin Developer Kit to Advance Robotics and Edge AI

One Million Developers Now Deploying on Jetson; Microsoft Azure, John Deere, Medtronic, Amazon Web Services, Cisco, Hyundai Robotics, JD.com, Komatsu, Meituan Among Leading Adopters Tuesday, March 22, 2022—GTC—NVIDIA today announced the availability of the NVIDIA® Jetson AGX Orin™ developer kit, the world’s most powerful, compact and energy-efficient AI supercomputer for advanced robotics, autonomous machines, and

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The Next Generation of AI-enabled Robotics

This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. Applied machine learning and artificial intelligence are quickly becoming the new horizon of robotics applications, rapidly expanding the possibilities of automated solutions. At Ambarella, our SoCs are at the intersection of high performance, low power, and low

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Ready for Air: Welcome to a New Dawn for Aerial Autonomy

This blog post was originally published at Opteran Technologies’ website. It is reprinted here with the permission of Opteran Technologies. Opteran enables robust, fast, GPS free, verifiable autonomy for aerial systems, at previously unimaginable size, weight (~30g), power (~3W) and hardware costs using consumer 2D cameras Today we’re happy to share a first glance at our

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Inuitive Demonstration of Its Multi-core Processor For 3D Imaging, Deep Learning and Computer Vision

Dor Zepeniuk, Chief Technology Officer and Vice President of Products at Inuitive, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Zepeniuk demonstrates the company’s NU4000, a multi-core processor for 3D imaging, deep learning and computer vision. Zepeniuk demos the diverse edge computing and other capabilities

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eYs3D Microelectronics Demonstration of Stereo Vision for Robotic Automation and Depth Sensor Fusion

James Wang, Technical General Manager at eYs3D Microelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Wang demonstrates stereo vision for robotic automation and depth sensor fusion. Depth-sensing technology is now being widely adopted commercially in various consumer and industrial products. It’s commonly recognized that

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ADLINK Releases its First SMARC Module Based on Qualcomm QRB5165 Enabling High Performance Robots and Drones at Low Power

Integrated IoT technologies provide on-device AI capabilities at the edge Summary: The LEC-RB5 SMARC is a high-performance module, built with the Qualcomm® QRB5165 processor, allowing on-device AI and 5G connectivity capabilities for consumer, enterprise and industrial robots. It features a high performance NPU, Octa-Core (8x Arm Coretex-A77 cores) CPU, low power consumption and support for

ADLINK Releases its First SMARC Module Based on Qualcomm QRB5165 Enabling High Performance Robots and Drones at Low Power Read More +

Synopsys Demonstration of SLAM Acceleration on DesignWare ARC EV7x Processors

Liliya Tazieva, Software Engineer at Synopsys, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Tazieva demonstrates simultaneous localization and mapping (SLAM) acceleration on Synopsys’ DesignWare ARC EV7x processors. SLAM creates and updates a map of an unknown environment while at the same time keeping track

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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PO Box #4446
Walnut Creek, CA 94596

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