Automation can vary from level 0 to level 5 within the automotive industry, from sole reliance on driver control, all the way to completely driverless vehicles. Roboshuttles and autonomous buses will likely strive for level 5 operation as a long-term goal but are currently aiming for level 4, where driverless operation can take place within […]
Driverless Routes, Roboshuttles and Autonomous Buses Read More +
After years of development, numerous hurdles, and uncountable unfulfilled promises, it looks like the robotaxi industry is finally taking shape. Over the past couple of years, IDTechEx has reported on the emergence of commercial robotaxi services but has always needed to caveat this with the fact that they have been heavily restricted. There would always
Autonomous Vehicle Industries Now and In 10 Years Read More +
The sensor technology landscape is rapidly evolving, driven by societal shifts and technological advancements. As we look towards 2035, the demand for sensors is expected to grow significantly across various sectors, including automotive, industrial, healthcare, consumer electronics, and environmental monitoring. This article explores the key trends and innovations in sensor technology, drawing insights from IDTechEx’s
The Future of Sensor Technology Read More +
In the rapidly evolving world of semiconductors, chiplet technology is emerging as a groundbreaking approach that addresses many of the challenges faced by traditional monolithic System-on-Chip (SoC) designs. As Moore’s Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density, as detailed in the IDTechEx
Chiplets: Revolutionizing Semiconductor Design and Manufacturing Read More +
The future of the automotive industry is heading towards the acceptance of automation and the enforcement of electrification, with IDTechEx‘s latest report, Future Automotive Technologies 2024-2034: Applications, Megatrends, Forecasts covering all the latest and future developments. Despite the crossover of these two phenomena becoming increasingly present within the automotive industry, automation and electrification individually offer
Autonomy and Eliminating Emissions – Exploring the Automotive Future Read More +
Driver monitoring systems and occupant monitoring systems operating within a vehicle are designed to enhance passenger welfare and increase the safety of vehicles. IDTechEx outlines technologies from infrared cameras and time-of-flight cameras, to potential ECG monitoring within the steering wheel in their report, “In-Cabin Sensing 2024-2034: Technologies, Opportunities and Markets“. Infrared uses and adoption RGB-infrared
In-cabin Sensing: Gaze Tracking and Steering Wheel Sensors Read More +
The Society of Automotive Engineers defines 6 levels (0 to 5) of autonomy available to vehicles, ranging from level 0 (no automation) to level 5 (full automation). The jump from level 2 to 3 is a large one that has seen limited deployment, as automotive OEMs assume greater liability, and eyes can be taken off
How Do LWIR Cameras Fit Into Vehicles of Today and In the Future? Read More +
Mobile robots in logistics can be seen to work throughout an entire supply chain from manufacturing processes, to reaching consumers and shops. IDTechEx‘s report, “Mobile Robotics in Logistics, Warehousing and Delivery 2024-2044“, provides an in-depth overview of the role of new robot technologies at each stage of the chain, highlighting mobility, flexibility, and scalability as
Robotic Independence in Logistics Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Automotive OEMs are moving upstream in the semiconductor supply chain with diverse strategies. OUTLINE The automotive semiconductor market is expecting a significant CAGR of 11% between 2023 and 2029 to almost $100
Electrification and Autonomy: A Semiconductor Content Boost to $1,000 per Car by 2029 Read More +
As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex. Challenges include developing the right materials and innovating packaging manufacturing techniques. IDTechEx‘s “Materials and Processing
Advanced Semiconductor Packaging: Key Materials and Processing Trends Read More +
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