Market Analysis

Why Is Advanced Semiconductor Packaging Needed? This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging.

For more information, visit https://semico.com/content/soc-silicon-and-software-design-cost-analysis. The semiconductor industry is faced with several substantial issues—the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs, and the increase in the design cycle time against shrinking market windows and decreasing product life cycles. An additional factor has now been added to

Anyone with access to social media platforms will likely have heard of ChatGPT by now. Created by OpenAI and released in November 2022, the generative AI tool had 100 million registered users as of three months after release, with it – the world’s most advanced chatbot – being used to answer simple queries, write songs,

For more information, visit https://semico.com/content/system-chip-market-analysis-and-methodology. Design cycle times have lengthened, product life cycles have become shorter, consumer-driven applications and competition among chip and OEM manufacturers drives the use of SoCs. It is estimated that the time to design complex SoC silicon is twelve to sixteen months, and a typical product life cycle is less than twelve