Market Analysis

Exploring Materials and Processing for Advanced Semiconductor Packaging

Why Is Advanced Semiconductor Packaging Needed? This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging. […]

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Average Design Cost for Advanced Performance Multicore SoCs to Reach $12.2M by 2027

For more information, visit https://semico.com/content/soc-silicon-and-software-design-cost-analysis. The semiconductor industry is faced with several substantial issues—the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs, and the increase in the design cycle time against shrinking market windows and decreasing product life cycles. An additional factor has now been added to

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AI and Security: Ensuring That Opportunities Outweigh the Threats

Anyone with access to social media platforms will likely have heard of ChatGPT by now. Created by OpenAI and released in November 2022, the generative AI tool had 100 million registered users as of three months after release, with it – the world’s most advanced chatbot – being used to answer simple queries, write songs,

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Vision Markets Report Predicts Machine Vision Market at $9.45B in 2027

For more information, visit https://markets.vision/services/machine-vision-quantitative-market-report/. The Vision Markets analysts forecast the global market to grow by 8% annually and reach a total of $9.45bn in 2027. New markets growth higher than average. Vision Markets, the leading consulting company in the machine vision industry, released its latest Machine Vision Components Quantitative Market Report. The machine vision

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SoC Market Forecasted to Grow to $250B by 2027

For more information, visit https://semico.com/content/system-chip-market-analysis-and-methodology. Design cycle times have lengthened, product life cycles have become shorter, consumer-driven applications and competition among chip and OEM manufacturers drives the use of SoCs. It is estimated that the time to design complex SoC silicon is twelve to sixteen months, and a typical product life cycle is less than twelve

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Innovation Beyond Moore’s Law: Advanced Packaging Explores New Frontiers

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. ECTC explores integration, bonding technologies and new materials in search of advanced packaging for the AI age Advanced packaging is a linchpin for the semiconductor industry which is wrestling with integrating multiple

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Advanced Semiconductor Packaging: A New Geopolitical Battleground

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Geopolitical tensions are making advanced semiconductor packaging increasingly crucial… OUTLINE The Advanced Packaging (AP) market, valued at US$44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022

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Buying an Autonomous Electric Car Will Feel More Like Buying a Laptop Than a Car

Computer chips have been part of cars for a long time, but no one really cares about them until they stop working or they are late to the production line, grinding manufacturing to an industry-shaking halt. However, the research within IDTechEx’s “Semiconductors for Autonomous and Electric Vehicles 2023-2033” report shows that trends within the automotive

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NVIDIA Sets the Pace for the AI Era

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Record breaking results announced by NVIDIA have fuelled speculation of an AI goldrush. Days later, the company introduced platforms for generative AI at Computex 2023. Yole Group and its entities, Yole SystemPlus

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