2.5D and 3D – IDTechEx Explores Advanced Semiconductor Packaging
High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx’s report, “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications“, goes into detail about emerging technologies, including 2.5D and 3D packaging. The level up While 1D and 2D semiconductor technologies continue to dominate many applications, the […]
2.5D and 3D – IDTechEx Explores Advanced Semiconductor Packaging Read More +