High precision and accuracy in a robust and compact design for real-time 3D recordings in industrial automation, robotics, logistics and medicine Ahrensburg, September 01, 2020 – The second generation of 3D cameras goes into series production at camera manufacturer Basler. Equipped with the latest Sony DepthSense™ sensor technology and highly efficient VCSEL laser diodes, the […]
Basler blaze 3D Camera Goes into Series Production Read More +
August 31, 2020 – San Diego – Qualcomm Technologies, Inc. announced the Qualcomm® Snapdragon™ 732G Mobile Platform, a follow-on to the Snapdragon 730G. Snapdragon 732G is designed to deliver immersive gameplay backed by smarter, faster artificial intelligence (AI) and accelerated performance, including an upgraded GPU and CPU compared to the previous generation. “Snapdragon 732G will
Qualcomm Announces Snapdragon 732G to Improve High-Tier Mobile Gaming Read More +
August 27, 2020 – San Diego – Automotive technology company Veoneer, Inc. and Qualcomm Technologies, Inc. have decided to collaborate on the delivery of scalable Advanced Driver Assistance Systems (ADAS), Collaborative and Autonomous Driving (AD) solutions powered by Veoneer’s next-generation perception and driving policy software stack and Qualcomm® Snapdragon Ride™ ADAS/AD scalable portfolio of System
Veoneer and Qualcomm to Power Next Generation ADAS and Autonomous Driving Systems Read More +
August 27, 2020–HILLSBORO, OR–(BUSINESS WIRE)–Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced that it is a Gold level sponsor of the Embedded Vision Summit 2020 (EVS), the premier conference for innovators adding computer vision and AI to products. This year’s event will be held virtually and takes place on Tuesdays and Thursdays
SEOUL, August 27th – The leading semiconductor silicon HW IP provider, Chips&Media (C&M), today announced its collaboration with SiFive to expedite the speed of delivering silicon solutions by offering C&M’s proprietary IP cores through OpenFive, a self-contained and autonomous business unit program by SiFive. SiFive collaborates with the partners and customers to innovate on segment-specific
At analytica in Munich from October 19 to 22, 2020, Basler AG is presenting highlights in its camera portfolio for Medical & Life Sciences – from the Basler MED ace series with the most recent Dust Protection MED Feature Set and the Basler boost bundle of CoaXPress 2.0 camera and interface card to new embedded
Basler at analytica: Camera Portfolio for Medical & Life Sciences Read More +
Sensor Provides Greatest Value for Consumer IoT Security Cameras, Featuring Best-in-Class Low-Light Image Captures With Improved SNR1 and Reduced Power Consumption SANTA CLARA, Calif. – Aug. 25, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OS02G10 security image sensor, which provides the best value for mainstream, high-volume
MUNSTER, GERMANY, August 24, 2020 –XIMEA, the pioneer in camera miniaturization, has prepared for production the smallest industrial USB3 imager with the highest resolution yet: https://www.ximea.com/en/products-news/usb3-industrial-small-mini/ It started with camera models based on 5 Mpix sensors using USB 2.0 interface and now XIMEA made accessible for the general public the first miniature cameras with On
Smallest Industrial USB3 Camera With 18 Mpix is Released Into Production Read More +
Built from-the-ground-up for assessing wind-blade quality, waveCHECK is accelerating how defects are measured in composite structures. CONSTANCE, Germany, & RANCHO CUCAMONGA, Calif. (PRWEB)August 20, 2020 – Following the growing success of its dentCHECK tool within the aerospace and aviation sectors, 8tree is pleased to announce the launch of its newest product – waveCHECK – a
8tree Enters Renewables Sector with waveCHECK, Targeting Wind Turbine Blade Quality Read More +
August 18, 2020 – VeriSilicon Microelectronics (Shanghai) Co., Ltd. (VeriSilicon, 688521.SH) today successfully landed on the Sci-Tech Innovation Board (STAR Market) of the Shanghai Stock Exchange, China. VeriSilicon priced its IPO at RMB38.53 per share, the offering raised approximately RMB1.86 billion, giving the company a total market value of RMB$18.6 billion. When the stock market
The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market Read More +
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Berkeley Design Technology, Inc.
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