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Intel Movidius Neural Compute Stick Honored with CES Best of Innovation Award 2018

New York City – NY, November 9th, 2017: Today the Consumer Electronics Association held their annual CES Unveiled event in New York City, and awarded the Intel® Movidius™ Neural Compute Stick as the Best of Innovation 2018 Honoree for the embedded technologies category. The CES Innovation Awards is an annual competition honoring outstanding design and […]

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Ground-breaking Image Sensor from ON Semiconductor Enables Next Generation ADAS Solution

State-of-the-art functionality improves camera performance and increases traffic safety PHOENIX, Arizona – Nov. 9, 2017 – ON Semiconductor Corporation (Nasdaq: ON), driving energy efficient innovations, today announced that Bosch has selected ON Semiconductor, the world leader in automotive image sensors, as the image sensor supplier for a future camera technology for advanced driver assistance systems (ADAS). Engineered to meet

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Growth in Automotive Brings videantis Third Deloitte Technology Fast 50 Award

Hannover, Germany, November 9th, 2017 – videantis GmbH, a leading technology supplier for autonomous vehicles, augmented and virtual reality, and intelligent camera solutions announced today that it won its third Deloitte Technology Fast 50 award. The prize is awarded to the 50 fastest-growing German technology companies based on revenue growth over the past four years.

Growth in Automotive Brings videantis Third Deloitte Technology Fast 50 Award Read More +

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Xilinx at SC17 Showcases Reconfigurable Acceleration at Cloud Scale

SAN JOSE, November 8, 2017 – Xilinx, Inc. (NASDAQ: XLNX) today announced it will showcase reconfigurable application acceleration at cloud scale at SC17. Through a series of demonstrations and presentations, Xilinx and its ecosystem will highlight how Xilinx® technologies are ideally suited to handle computationally intensive data center workloads including data analytics, video transcoding, machine

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Latest 1/4-Inch 1.0 Mp CMOS Global Shutter Image Sensor Delivers High Performance Imaging for All Light Conditions in a New Smaller Package

AR0144 Global shutter device from ON Semiconductor achieves fast, clean and accurate imaging in static applications such as high-speed barcode scanners, and dynamic uses including drones and AR/VR PHOENIX, Ariz. – 7 November, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a new 1/4-inch, 1.0 Megapixel (Mp) (1280H x 800V) CMOS digital image sensor which

Latest 1/4-Inch 1.0 Mp CMOS Global Shutter Image Sensor Delivers High Performance Imaging for All Light Conditions in a New Smaller Package Read More +

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HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor

Tensilica Vision P6 DSP increases imaging/vision performance by up to 4X compared to the highly successful Vision P5 DSP SAN JOSE, Calif., November 6, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970

HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor Read More +

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Allied Vision 1 Product Line Awarded by French Metrology Magazine

The French magazine "mesures" awards Allied Vision the "Palmarès technologique" for industrial vision 2017 Stadtroda, November 1, 2017 – Allied Vision’s new camera platform and its ALVIUM® Technology were awarded by the French metrology magazine "mesures". The 1 Product Line won the award in the category industrial vision (Vision industrielle). Representing Allied Vision, Philippe Berger

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BrainChip Completes Placement to Raise A$21.5 Million

BrainChip raises A$21.5 million in an oversubscribed share placement. Placement was supported by a large number of institutions. Funds raised will allow BrainChip to accelerate its commercialization strategy and to further develop its existing video analytics products and its planned AKIDA™ Neuromorphic Processor Unit. San Francisco – 31 October, 2017 BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX: BRN), a

BrainChip Completes Placement to Raise A$21.5 Million Read More +

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Embedded Vision Alliance Announces Call for Papers for 2018 Embedded Vision Summit

WALNUT CREEK, Calif., Oct. 24, 2017 /PRNewswire/ — The Embedded Vision Alliance today announced its call for papers has opened for the 2018 Embedded Vision Summit™, which will take place May 22-24, 2018, in Santa Clara, CA. The Embedded Vision Summit is the only event focused exclusively on deployable computer vision, attracting a global audience

Embedded Vision Alliance Announces Call for Papers for 2018 Embedded Vision Summit Read More +

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Qualcomm Snapdragon 636 Mobile Platform Delivers Significant Increases in Performance, Gaming and Display Technology

HONG KONG, Oct. 16, 2017 /PRNewswire/ — Qualcomm Incorporated (NASDAQ:QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced a new mobile platform, the Qualcomm® Snapdragon™ 636, designed to provide improvements to device performance, enhanced gaming and display technology support in comparison to the Snapdragon 630 Mobile Platform. The Snapdragon 636 continues to build out the

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