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HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor

Tensilica Vision P6 DSP increases imaging/vision performance by up to 4X compared to the highly successful Vision P5 DSP SAN JOSE, Calif., November 6, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970 […]

HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor Read More +

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Allied Vision 1 Product Line Awarded by French Metrology Magazine

The French magazine "mesures" awards Allied Vision the "Palmarès technologique" for industrial vision 2017 Stadtroda, November 1, 2017 – Allied Vision’s new camera platform and its ALVIUM® Technology were awarded by the French metrology magazine "mesures". The 1 Product Line won the award in the category industrial vision (Vision industrielle). Representing Allied Vision, Philippe Berger

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BrainChip Completes Placement to Raise A$21.5 Million

BrainChip raises A$21.5 million in an oversubscribed share placement. Placement was supported by a large number of institutions. Funds raised will allow BrainChip to accelerate its commercialization strategy and to further develop its existing video analytics products and its planned AKIDA™ Neuromorphic Processor Unit. San Francisco – 31 October, 2017 BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX: BRN), a

BrainChip Completes Placement to Raise A$21.5 Million Read More +

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Embedded Vision Alliance Announces Call for Papers for 2018 Embedded Vision Summit

WALNUT CREEK, Calif., Oct. 24, 2017 /PRNewswire/ — The Embedded Vision Alliance today announced its call for papers has opened for the 2018 Embedded Vision Summit™, which will take place May 22-24, 2018, in Santa Clara, CA. The Embedded Vision Summit is the only event focused exclusively on deployable computer vision, attracting a global audience

Embedded Vision Alliance Announces Call for Papers for 2018 Embedded Vision Summit Read More +

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Qualcomm Snapdragon 636 Mobile Platform Delivers Significant Increases in Performance, Gaming and Display Technology

HONG KONG, Oct. 16, 2017 /PRNewswire/ — Qualcomm Incorporated (NASDAQ:QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced a new mobile platform, the Qualcomm® Snapdragon™ 636, designed to provide improvements to device performance, enhanced gaming and display technology support in comparison to the Snapdragon 630 Mobile Platform. The Snapdragon 636 continues to build out the

Qualcomm Snapdragon 636 Mobile Platform Delivers Significant Increases in Performance, Gaming and Display Technology Read More +

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Qualcomm and SenseTime to Collaborate to Drive On-Device Artificial Intelligence

SAN DIEGO, Oct. 19, 2017 /PRNewswire/ — Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and SenseTime Group Limited today announced plans to collaborate on artificial intelligence (AI) and machine learning (ML) for future mobile and IoT products. This collaboration will draw from the expertise of both companies in AI by leveraging SenseTime's ML

Qualcomm and SenseTime to Collaborate to Drive On-Device Artificial Intelligence Read More +

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New HUAWEI Mate 10 Takes the Smartphone Experience to the Next Level With Integrated Artificial Intelligence

Introducing the era of the intelligent machine with ultimate speed, power, and performance MUNICH, Oct. 17, 2017 /PRNewswire/ — Today Huawei reveals the highly anticipated HUAWEI Mate 10 and HUAWEI Mate 10 Pro featuring the world's first artificially intelligent chipset with dedicated Neural Network Processing Unit (NPU). With AI-based enhancements and machine learning integrated throughout,

New HUAWEI Mate 10 Takes the Smartphone Experience to the Next Level With Integrated Artificial Intelligence Read More +

Machine Vision: MVTec Presents New HALCON Version with Extensive Deep Learning Functions

HALCON 17.12 optimizes detection rates and classification results Sophisticated and out-of-the-box deep learning functions Release in December Munich, October 27, 2017 – MVTec Software GmbH (www.mvtec.com), the leading provider of innovative machine vision technologies, will release the new version 17.12 of its standard software HALCON on December 8. The extraordinary feature of the new version

Machine Vision: MVTec Presents New HALCON Version with Extensive Deep Learning Functions Read More +

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New 2.3Mp CMOS Digital Image Sensor from ON Semiconductor is First to Combine 1080p Resolution with BSI Pixel Technology to Satisfy Challenging Security and Surveillance Applications

Three-exposure high dynamic range (HDR) ensures detail captured in both bright and poor light areas in the same scene PHOENIX, Ariz. – 27 October, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a new 1/2.7-inch 2.3 Megapixel (Mp) CMOS digital image sensor with an active-pixel array of 1936H x 1188V. The AR0239 produces extraordinarily clear

New 2.3Mp CMOS Digital Image Sensor from ON Semiconductor is First to Combine 1080p Resolution with BSI Pixel Technology to Satisfy Challenging Security and Surveillance Applications Read More +

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BrainChip and its Customers to Demonstrate AI-Powered Video Analytics Technology at Milipol 2017

Inspector Jean-Francois Lespes, Chief of the Indictable Offense Department at the Toulouse National Police, will be sharing use cases of BrainChip technology. BrainChip will be co-exhibiting with Rockwell Collins, which uses BrainChip’s technology in its Perimeter Surveillance Radar system. San Francisco – 26 October 2017: BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX:BRN), a leading

BrainChip and its Customers to Demonstrate AI-Powered Video Analytics Technology at Milipol 2017 Read More +

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