Xilinx Stays a Generation Ahead at 16nm with New Memory, 3D-on-3D, and Multi-Processing SoC Technologies
New UltraScale+ FPGA, SoC, and 3D IC applications include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS, and industrial IoT SAN JOSE, Calif., Feb. 23, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ:XLNX) today announced its 16nm UltraScale+™ family of FPGAs, 3D ICs, and MPSoCs, combining new memory, 3D-on-3D and multi-processing SoC (MPSoC) technologies, […]