News

NORWOOD, Mass.–(BUSINESS WIRE)– Analog Devices, Inc. (ADI) introduced today two low-cost Blackfin® processor-based development platforms targeting demanding ultra-low-power, real-time applications for image sensing and advanced audio. The Blackfin Low Power Imaging Platform (BLIP) leverages the ADSP-BF707 Blackfin processor as well as Analog Devices’ optimized software libraries for video occupancy sensing. The ADSP-BF706 EZ-KIT Mini® development […]

New CEVA-XM4 imaging and vision IP takes embedded vision one step closer to human vision, enabling: Real-time 3D depth map and point cloud generation Deep learning and neural network algorithms for object recognition and context awareness Computational photography for image enhancement including zoom, image stabilization, noise reduction and improved low-light capabilities MOUNTAIN VIEW, Calif., Feb.

Automotive logiADAK 3.0 Advanced Driver Assistance Development Kit with logiOWL IP enables on-target, full vehicle level multi-camera calibration in seconds SAN JOSE, Calif., Feb. 24, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) and Xylon today announced new industry leading automated multi-camera image stitching IP for 2D/3D surround view systems.  The Automotive logiADAK 3.0 Advanced Driver

Visit ON Semiconductor at the conference in Hall 5, Booth 178, featured demonstrations include: High performance industrial image sensors Wired and wireless connectivity solutions Motor control solutions Power solutions Embedded World Conference – NUREMBERG, Germany – Feb. 24, 2015 – ON Semiconductor (Nasdaq: ONNN), driving energy efficiency innovations, will demonstrate new innovative solutions for embedded

Significant Leap Forward in Performance and Power Efficiency Reported Using Altera High-end FPGAs with Hard Floating Point DSP Blocks San Jose, Calif., —February 23, 2015 — Altera Corporation (NASDAQ: ALTR) today announced Microsoft (NASDAQ: MSFT) is using Altera Arria® 10 FPGAs (field programmable gate arrays), to achieve compelling performance-per-Watt in data center acceleration based on

SAN JOSE, Calif.–(BUSINESS WIRE) — FotoNation Limited, a wholly owned subsidiary of Tessera Technologies, Inc. (TSRA) and the leading provider of computational imaging solutions for smartphones and digital still cameras, today announced its acquisition of Smart Sensors Limited (“SSL”), an award winning developer of iris recognition biometric technology, a transaction that closed in the fourth

New UltraScale+ FPGA, SoC, and 3D IC applications include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS, and industrial IoT SAN JOSE, Calif., Feb. 23, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ:XLNX) today announced its 16nm UltraScale+™ family of FPGAs, 3D ICs, and MPSoCs, combining new memory, 3D-on-3D and multi-processing SoC (MPSoC) technologies,

Cadence executives and partners to present and demonstrate the latest processors, IP and more. SAN JOSE, Calif., Feb. 17, 2015 /PRNewswire/ — WHO: Cadence Design Systems, Inc. (NASDAQ:CDNS) is scheduled to demonstrate its latest advancements and solutions for mobile technology challenges, in collaboration with customers and partners, at Mobile World Congress (MWC) 2015. To sign

Qualcomm Extends Snapdragon Brand to Modem Chipsets; Introduces Premium Features and Performance to High Volume Tiers SAN DIEGO, Feb. 18, 2015 /PRNewswire/ — Qualcomm Incorporated (NASDAQ: QCOM) today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has introduced four new Qualcomm® Snapdragon(TM) processors aimed at enhancing user experience and connectivity for high-performance and high-volume mobile

Hannover and Lübeck, Germany, February 20, 2015, – Videantis and gestigon today announced a partnership that teams videantis’s low-power vision processing IP platform with gestigon’s unique skeleton tracking and gesture recognition algorithms. The videantis and gestigon CEOs sealed the partnership last month at the Consumer Electronics Show in Las Vegas. Besides targeting consumer electronics, the