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Cornell Tech Joins BrainChip University AI Accelerator Program

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Laguna Hills, Calif. – February 27, 2024 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced that Cornell Tech has joined the BrainChip University AI Accelerator Program. Cornell Tech is an applied sciences and engineering campus in New […]

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ProHawk Gains NVIDIA Preferred Partner Status for its AI-enabled Computer Vision Solutions

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ProHawk solutions validated in NVIDIA’s labs over the past 18 months, and now embedded with NVIDIA Metropolis, Holoscan, and Jetson platforms, with more integrations coming. LAKE MARY, FLORIDA, February 27, 2024 — ProHawk Technology Group (ProHawk AI), a leading AI-enabled computer vision company, today announced that it has been selected as a Preferred partner within

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Intel Core Ultra Extends AI PCs to the Enterprise with New Intel vPro Platform

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New vPro platform delivers unmatched productivity, security, manageability and stability for businesses of all sizes. What’s New: Today at MWC 2024, Intel extends the benefits of the AI PC to commercial customers with the new Intel vPro® platform. The enhanced features of Intel® Core™ Ultra processors with available built-in Intel® Arc™ GPUs, and Intel® Core™

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Intel Announces New Edge Platform for Scaling AI Applications

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The edge-native software platform simplifies development, deployment and management of edge AI applications. What’s New: At MWC 2024, Intel announced its new Edge Platform, a modular, open software platform enabling enterprises to develop, deploy, run, secure, and manage edge and AI applications at scale with cloud-like simplicity. Together, these capabilities will accelerate time-to-scale deployment for

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Micron Commences Volume Production of Industry-leading HBM3E Solution to Accelerate the Growth of AI

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Micron HBM3E helps reduce data center operating costs by consuming about 30% less power than competing HBM3E offerings BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and storage solutions, today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution. Micron’s 24GB 8H

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Qualcomm Continues to Bring the Generative AI Revolution to Devices and Empowers Developers with Qualcomm AI Hub

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Highlights: Qualcomm now enables at-scale on-device AI commercialization across next-generation PCs, smartphones, software-defined vehicles, XR devices, IoT and more – bringing intelligent computing everywhere. Qualcomm AI Hub offers 75+ optimized AI models for Snapdragon and Qualcomm platforms, reducing time-to-market for developers and unlocking the benefits of on-device AI for their apps. These models are also

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NVIDIA RTX 500 and 1000 Professional Ada Generation Laptop GPUs Drive AI-enhanced Workflows From Anywhere

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Thin and light designs deliver advanced AI, compute and graphics horsepower for professionals on the go. With generative AI and hybrid work environments becoming the new standard, nearly every professional, whether a content creator, researcher or engineer, needs a powerful, AI-accelerated laptop to help users tackle their industry’s toughest challenges — even on the go.

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STMicroelectronics Expands into 3D Depth Sensing with Latest Time-of-flight Sensors

News, Object Identification, Object Tracking, Sensors and Cameras, STMicroelectronics /

Building on a leading position in direct Time-of-Flight sensors, with two billion FlightSense™ devices sold, ST reveals new direct and indirect Time-of-Flight sensors for key applications like camera assist, virtual reality, 3D webcam, robotics and smart buildings Market-first true all-in-one dToF LiDAR module with up to 2.3k zones, targets smartphone camera-assist and AR/VR applications The

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Choosing Your Path with FRAMOS: Navigating Optical Image Sensor Module Complexities

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February 22, 2024 – FRAMOS, a leading imaging company, is excited to announce a free webinar “Build vs Buy: Navigating Optical Image Sensor Module Complexities” hosted by the Edge AI and Vision Alliance. This webinar represents a significant milestone for the company and demonstrates its commitment to providing embedded vision solutions. On March 7, 2024,

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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