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Blaize Partners with Korea Telecom to Bring AI Transformation to Industrial and Enterprise Customers

Delivers AIoT (Artificial Intelligence of Things) edge technology for autonomous driving, robotics, and mobility AI vision surveillance management EL DORADO HILLS, CA — December 13, 2022 —Blaize® today announced a multi-year Memorandum of Understanding with Korea Telecom (KT) — Korea’s leading AI, big data, and cloud service provider. The strategic collaboration brings AIoT (Artificial Intelligence […]

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CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022

Aimed at AI/ML applications in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute NeuPro-M awarded as ‘Most Promising Product’ 3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X ROCKVILLE, MD – December 13, 2022 – CEVA, Inc. (NASDAQ: CEVA),

CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022 Read More +

KI-FLEX AI Chip Tapes Out With Flexible videantis Processor Platform

Hannover, Germany, December 13, 2022 – videantis GmbH, provider of a unified platform for combined processing of algorithms as diverse as AI (Artificial Intelligence), multi-modal sensor data processing and fusion, or video coding on a single architecture, today announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. The

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Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance

Ultra-Low-Power Chip Provider Recognized for Breakthroughs in Edge AI Solutions Irvine, Calif., December 12, 2022 — Syntiant Corp., a provider of deep learning solutions for always-on edge AI voice, sensor and vision applications, today announced that the company was named 2022’s “Start-Up to Watch” during this year’s Global Semiconductor Alliance (GSA) Awards. Syntiant was selected

Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance Read More +

BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge

Laguna Hills, Calif. – December 11, 2022 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power neuromorphic AI IP, today announced that it has become a member of the Intel Foundry Services (IFS) ecosystem alliance to help advance innovation on Intel’s foundry manufacturing platform. BrainChip is

BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge Read More +

Teledyne Cameras Enable VR Play at TOCA Social

Popular restaurant chain selects Teledyne’s Genie Nano cameras for its sports themed VR restaurants Waterloo, CANADA ─December 8, 2022 ─ Teledyne DALSA is pleased to announce that TOCA Social, the world’s first soccer and dining experience, has chosen Teledyne DALSA Genie Nano cameras to enable the capture of play in its interactive soccer based competitive socializing

Teledyne Cameras Enable VR Play at TOCA Social Read More +

MediaTek’s New Dimensity 8200 Upgrades Experiences on Premium 5G Smartphones

HSINCHU, Taiwan – December 1, 2022 – MediaTek today announced the Dimensity 8200, the company’s newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences – including connectivity, gaming, multimedia, displays and imaging – at a more accessible price point. Built on the 4nm-class process, the new chipset

MediaTek’s New Dimensity 8200 Upgrades Experiences on Premium 5G Smartphones Read More +

Blaize to Power New ASIC-based Edge AI System from Aetina

Small-sized embedded AI inference system to facilitate computer vision applications El Dorado Hills, CA, December 8, 2022 —Aetina, an edge AI solution provider that offers embedded computing hardware and software for AI and IoT, has launched a new ASIC-based edge AI system powered by the programmable Blaize® Pathfinder P1600 Embedded System on Module (SoM). The

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Lattice Extends Low Power Leadership with New Lattice Avant FPGA Platform

Delivers industry-leading power efficiency, small form factor and performance Expands product portfolio and doubles addressable market HILLSBORO, Ore. – Dec. 5, 2022 – Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today unveiled Lattice Avant™, a new FPGA platform purpose-built to bring the company’s power efficient architecture, small size, and performance leadership to mid-range

Lattice Extends Low Power Leadership with New Lattice Avant FPGA Platform Read More +

Novatek Adopts CEVA’s Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC

NT98530 Smart Camera SoC integrates CEVA SensPro2 DSP to support advanced computer vision and edge AI workloads, on-device Companies to showcase the SoC at CES 2023 in CEVA’s meeting suite ROCKVILLE, MD – December 5, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions today

Novatek Adopts CEVA’s Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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