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VeriSilicon AI-ISP Delivers Innovative Image Quality Enhancement that Breaks the Limits of Computer Vision

Low-power, low-latency and low-DDR bandwidth image quality upgrades enabled by VeriSilicon FLEXA San Jose, Calif., U.S., September 13, 2022–VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS®) company, today announced the launch of AI-ISP, an innovative AI image enhancement technology for applications including smartphones, automotive electronics, and Industrial Internet of Things (IIoT), providing advanced […]

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BrainChip Fortifies Neuromorphic Patent Portfolio with New Awards and IP Acquisition

Laguna Hills, Calif. – DATE, 2022 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power neuromorphic AI IP, has extended the breadth and depth of its neuromorphic IP with two new patents granted by the US Patents and Trademarks Office (USPTO), and the acquisition of previously

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EuroBLECH Tradeshow: Inline Metal Bending Control with Autonomous Laser Profiler

October 13, 2022 – At the EuroBLECH tradeshow, Vision Components (booth 12-A02) will showcase its tested and proven laser profiler for angle measurement and inline control of sheet metal bending processes. The VC nano3D-Z laser triangulation sensor operates autonomously, without an external computing unit, and is already fully calibrated for angle measurement. It enables dynamic

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InferSens to Introduce Ultra-Low-Power Edge DL Sensor Solution with Syntiant Technology

Battery-Powered Sensor with Embedded Syntiant NDP120 Neural Decision Processor to Enable Highly Accurate On-Device Processing for Commercial and Industrial Applications. InferSens CTO Jonathan Peace to Present First Application for Legionella Water System Monitoring at the tinyML EMEA Innovation Forum 2022 in Cyprus Cambridge, U.K., and Irvine, Calif., October 11 – InferSens today announced the first

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MediaTek’s New Dimensity 1080 Brings a Performance Boost to 5G Smartphones

New 5G chipset packs impressive imaging features with 200MP camera support HSINCHU, Taiwan – October 11, 2022 – MediaTek today unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the

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Imagimob and Syntiant to Accelerate Development of Production-ready tinyML Applications

Joint Solution Demoed at tinyML EMEA Innovation Forum 2022 Stockholm and Irvine, Calif., October 10, 2022 – Imagimob, a leading provider of tinyML platforms, and Syntiant Corp, an end-to-end AI chip company for always-on edge AI applications, today announced a collaboration to integrate Imagimob’s tinyML platform with Syntiant’s ultra-low-power NDP120 Neural Decision Processor™. The integration

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Outsight’s Software Takes LiDAR to the Next Level

Outsight, the winner of the 2022 LIDAR Leader Award, takes the lead in bringing LiDAR to the entire geospatial market February 07, 2022 11:00 AM Eastern Standard Time–PARIS & DENVER, Colo.–(BUSINESS WIRE)–Outsight has received the 2022 LIDAR Leader Award for Outstanding Enterprise Achievement, presented by Geo Week and LIDAR Magazine within the framework of the

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Teledyne to Exhibit an Unmatched Range of New Industrial Imaging Technologies at the Vision Show

Waterloo, CANADA– October 6, 2022 – Teledyne will showcase their newest products and solutions at The Vision Show taking place October 11-13, in Boston, Massachusetts. Teledyne’s DALSA, e2v, FLIR and  Lumenera businesses will display the world’s most comprehensive, vertically integrated portfolio of industrial imaging technology. Visit Teledyne booth #227 and explore unmatched capabilities and products from

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Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support

New RZ/V2MA MPU Features an OpenCV Accelerator for Image Processing and Offers TVM-based Deep Learning Compiler September 29, 2022 ― TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, has expanded its AI-capable RZ/V Series of microprocessors (MPUs), with a new device that enables AI processing of image data

Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support Read More +

OEM Laser Profiler with Integrated 3D Image Processing

October 4, 2022 – Vision Components launches the new OEM laser profiler VC picoSmart 3D with integrated processors for 3D profile data analysis and further image processing tasks. All components are designed to function together perfectly: a miniaturized embedded vision system with a 1-megapixel image sensor, an FPGA and a high-end FPU processor and a

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Walnut Creek, CA 94596

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