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Imagination Launches Open Access Program, Providing Scale-ups with a Low-cost Path to Differentiated Silicon

Removing licensing fees and accelerating SoC development for growing businesses London, England – 31st May 2022 – Imagination Technologies announces its Open Access program, offering access for early-stage companies to select class-leading GPU and AI accelerator IP without any licensing costs. This lowers the barriers of entry to SoC design, enabling scale-ups to create advanced […]

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STMicroelectronics Releases First Automotive IMU with Embedded Machine Learning

May 24, 2020 – STMicroelectronics’ ASM330LHHX inertial measurement unit (IMU) moves smart driving another step closer to high levels of automation with its machine-learning (ML) core. The ML core enables fast real-time response and sophisticated functions with low system power demand. Leveraging ST’s micro-electro-mechanical systems (MEMS) technology, the automotive-qualified ASM330LHHX houses a 3-axis accelerometer and

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MegaChips Forms Strategic Partnership with BrainChip

Partnership Provides Ultra-Low Power and High-Performance Edge AI Solutions for ASIC Customers San Jose and Laguna Hills, Calif. – May 26, 2022 – MegaChips, the leading custom ASIC company in Japan, and BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power neuromorphic AI IP, formally announced a strategic partnership signed late last year.

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Block-based Editor: Create Vision Apps Without Programming Knowledge

New IDS NXT software release themed “App your camera!” May 25, 2022 – The current software release 2.6 for the AI vision system IDS NXT focuses primarily on simplifying app creation. The initial phase in development is often one of the greatest challenges in the realization of a project. With the help of the new

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e-con Systems Launches a Time of Flight (ToF) Camera for Accurate 3D Depth Measurement

Depth & RGB in single frame | 640×480 depth map | Frame rate – 30 fps | USB 3.1 Gen 1| Low light San Jose and Chennai (May 17, 2022) – e-con Systems™, a leading embedded camera company, launches DepthVista – a Time of Flight (ToF) camera that comes with a combination of a ToF

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Free Webinar Explores How to Accelerate TensorFlow Models on Intel Compute Devices Using Only 2 Lines of Code

On August 25, 2022 at 9 am PT (noon ET), Kumar Vishwesh, Technical Product Manager, and Ragesh Hajela, Senior AI Engineer, both of Intel, will present the free hour webinar “Accelerating TensorFlow Models on Intel Compute Devices Using Only 2 Lines of Code,” organized by the Edge AI and Vision Alliance. Here’s the description, from

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New 1 GHz SAMA7G54 is the First Single-Core MPU with MIPI CSI-2 Camera Interface and Advanced Audio Features

Based on Arm® Cortex®-A7 processor, Microchip’s new MPU combines high performance with low power consumption CHANDLER, Ariz., May 24, 2022 — The embedded market has a need for higher performing, yet lower power artificial intelligence (AI) solutions that can be deployed at the edge, where power consumption is often at a premium. AI solutions often

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Teledyne to Present Advanced Industrial and Scientific Imaging Technology at Automate 2022

Waterloo, Ontario, May 24, 2022 – Teledyne will display their newest products and solutions at Automate 2022 exhibition taking place June 6-9, in Detroit, Michigan. Teledyne will be showcasing the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Whether you’re designing systems for food processing or semiconductor inspection, developing the next

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MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity

Dimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio HSINCHU, Taiwan – May 23, 2022 – MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity

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