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Intel to Acquire Codeplay Software

Intel has long believed that innovation thrives in an open ecosystem, enables choice, fosters trust, and is equally accessible to all. The oneAPI project reflects and embodies this commitment to an open, vibrant, and active ecosystem, featuring an open specification, open source reference implementations, Technical Advisory Boards, and worldwide oneAPI Centers of Excellence. Since its […]

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Now Available: Teledyne FLIR 2022 Mono and Color Sensor Reviews

Today, we have more choice than ever when it comes to machine vision camera sensors and models. Beyond, megapixels and speed, a good place start narrowing down camera choices is with EMVA 1288 information. These specifications allow the comparison of the image quality of cameras and sensors such as read noise or how well they

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Snapdragon Spaces is Globally Available for All Developers to Download and Revolutionize Headworn AR

Highlights: Snapdragon Spaces™ XR Developer Platform is available for developers to download. The first Snapdragon Spaces ready hardware development kit, the Lenovo ThinkReality A3 smart glasses and a motorola edge+ smartphone, can be purchased. Qualcomm Ventures announces investments in echo3D and Tripp as part of the previously announced $100M Snapdragon™ Metaverse Fund. June 1, 2022

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Imagination Launches Open Access Program, Providing Scale-ups with a Low-cost Path to Differentiated Silicon

Removing licensing fees and accelerating SoC development for growing businesses London, England – 31st May 2022 – Imagination Technologies announces its Open Access program, offering access for early-stage companies to select class-leading GPU and AI accelerator IP without any licensing costs. This lowers the barriers of entry to SoC design, enabling scale-ups to create advanced

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STMicroelectronics Releases First Automotive IMU with Embedded Machine Learning

May 24, 2020 – STMicroelectronics’ ASM330LHHX inertial measurement unit (IMU) moves smart driving another step closer to high levels of automation with its machine-learning (ML) core. The ML core enables fast real-time response and sophisticated functions with low system power demand. Leveraging ST’s micro-electro-mechanical systems (MEMS) technology, the automotive-qualified ASM330LHHX houses a 3-axis accelerometer and

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MegaChips Forms Strategic Partnership with BrainChip

Partnership Provides Ultra-Low Power and High-Performance Edge AI Solutions for ASIC Customers San Jose and Laguna Hills, Calif. – May 26, 2022 – MegaChips, the leading custom ASIC company in Japan, and BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power neuromorphic AI IP, formally announced a strategic partnership signed late last year.

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Block-based Editor: Create Vision Apps Without Programming Knowledge

New IDS NXT software release themed “App your camera!” May 25, 2022 – The current software release 2.6 for the AI vision system IDS NXT focuses primarily on simplifying app creation. The initial phase in development is often one of the greatest challenges in the realization of a project. With the help of the new

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e-con Systems Launches a Time of Flight (ToF) Camera for Accurate 3D Depth Measurement

Depth & RGB in single frame | 640×480 depth map | Frame rate – 30 fps | USB 3.1 Gen 1| Low light San Jose and Chennai (May 17, 2022) – e-con Systems™, a leading embedded camera company, launches DepthVista – a Time of Flight (ToF) camera that comes with a combination of a ToF

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Free Webinar Explores How to Accelerate TensorFlow Models on Intel Compute Devices Using Only 2 Lines of Code

On August 25, 2022 at 9 am PT (noon ET), Kumar Vishwesh, Technical Product Manager, and Ragesh Hajela, Senior AI Engineer, both of Intel, will present the free hour webinar “Accelerating TensorFlow Models on Intel Compute Devices Using Only 2 Lines of Code,” organized by the Edge AI and Vision Alliance. Here’s the description, from

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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