News

e-con Systems Launches World’s First Hot-pluggable GMSL Automotive HDR Camera

Perfect High-Quality Imaging Across Any Environment California & Chennai (Oct 07, 2024): e-con Systems®, a leading provider of OEM camera solutions with over 20 years of vision experience, is proud to announce the launch of STURDeCAM34 – an IP69K-rated 3MP automotive multi-camera designed for the most demanding applications in the automotive and industrial domains. It […]

e-con Systems Launches World’s First Hot-pluggable GMSL Automotive HDR Camera Read More +

Synaptics Astra AI-native IoT Compute Platform Wins 2024 EDGE Award

SAN JOSE, Calif., Oct. 01, 2024 (GLOBE NEWSWIRE) — Synaptics® Incorporated (Nasdaq: SYNA) today announced that its Synaptics Astraâ„¢ AI-native IoT compute platform won in the Machine Learning and Deep Learning category of the 2024 EDGE Awards. The annual awards from Endeavor Media celebrate outstanding innovation in product design and function for the engineering industry.

Synaptics Astra AI-native IoT Compute Platform Wins 2024 EDGE Award Read More +

STMicroelectronics and Qualcomm Enter Strategic Collaboration in Wireless IoT

Strategic collaboration will pair STMicroelectronics’ market-leading STM32 microcontroller ecosystem and Qualcomm’s world-leading wireless connectivity solutions. Seamless integration into existing STM32 developer ecosystem to allow simple, fast, and cost-effective design of next-gen industrial and consumer IoT applications augmented by edge AI. Oct 1, 2024 – Geneva and San Diego – STMicroelectronics (NYSE: STM), a global semiconductor leader

STMicroelectronics and Qualcomm Enter Strategic Collaboration in Wireless IoT Read More +

BrainChip Introduces Lowest-power AI Acceleration Co-processor

Laguna Hills, Calif. – October 1, 2024 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event- based, brain-inspired AI, today introduced the Akida™ Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable

BrainChip Introduces Lowest-power AI Acceleration Co-processor Read More +

AMD Introducing Energy-efficient EPYC Embedded 8004 Series for Embedded Systems

October 1, 2024 – AMD continually sets the industry standard with its EPYCâ„¢ Embedded processors, offering exceptional performance, efficiency, connectivity, and innovation for networking, storage, and industrial applications. Today we are extending that leadership with the fourth-generation, AMD EPYC Embedded 8004 Series processors. The AMD EPYC Embedded 8004 Series processor is designed for compute-intensive embedded

AMD Introducing Energy-efficient EPYC Embedded 8004 Series for Embedded Systems Read More +

MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface to Enable Emerging Vehicle Architectures

Industry-leading specification simplifies the integration of image sensors and displays to support next-generation ADAS and ADS applications BRIDGEWATER, N.J., Sept. 26, 2024 — The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the release of MIPI A-PHY v2.0, the next version of the automotive high-speed asymmetric serializer-deserializer

MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface to Enable Emerging Vehicle Architectures Read More +

Vision Components at VISION 2024: Ultra-compact OEM Module for Triangulation Sensors

Vision Components presents a new, ultra-compact OEM module for the development of individual triangulation sensors for the first time at VISION. Ettlingen, September 26, 2024 – For the first time ever, Vision Components will present a new, ultra-compact OEM module for laser triangulation sensors at VISION 2024 (October 8-10, Messe Stuttgart). It is aimed at

Vision Components at VISION 2024: Ultra-compact OEM Module for Triangulation Sensors Read More +

Renesas Leads ADAS Innovation with Power-efficient 4th-generation R-Car Automotive SoCs

New R-Car V4M & V4H SoC Devices Target High-Volume L2 and L2+ ADAS Market While Maintaining Scalability and Software Reusability with Existing R-Car Devices TOKYO, Japan, September 24, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance

Renesas Leads ADAS Innovation with Power-efficient 4th-generation R-Car Automotive SoCs Read More +

Intel Unveils Next-generation AI Solutions with the Launch of Xeon 6 and Gaudi 3

NEWS HIGHLIGHTS Intel launches Xeon 6 with Performance-cores (P-cores), doubling the performance for AI and HPC workloads. New Gaudi 3 AI accelerators offer up to 20 percent more throughput and 2x price/performance vs H100 for inference of LLaMa 2 70B1. SANTA CLARA, Calif., September 24, 2024 – As AI continues to revolutionize industries, enterprises are

Intel Unveils Next-generation AI Solutions with the Launch of Xeon 6 and Gaudi 3 Read More +

Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications

Partnership enables AI developers to train, optimize and deploy embedded ML models on the Ceva-NeuPro-Nano NPU IP, pre-silicon, via Edge Impulse Platform ROCKVILLE, Md., Sept. 24, 2024 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and

Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top