Cadence

Cadence Demonstration of Real-time Visual SLAM for Embedded Devices

Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Borkar demonstrates Xvisio’s highly accurate 3D camera position and tracking using Visual SLAM (VSLAM), implemented on a customer’s platform and featuring the […]

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Cadence Demonstration of Ultra-low Power Always-on Applications on the Tensilica Vision P1 DSP

Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2022 Embedded Vision Summit. Specifically, Borkar demonstrates Tensilica’s latest processor from the Vision DSP family, the Vision P1 DSP, running on Cadence’s own FPGA platform. The Vision

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“Designing the Next Ultra-Low-Power Always-On Solution,” a Presentation from Cadence

Amol Borkar, Director of Product Management and Marketing for Tensilica Vision and AI DSPs at Cadence, presents the “Designing the Next Ultra-Low-Power Always-On Solution” tutorial at the May 2022 Embedded Vision Summit. Increasingly, users expect their systems to be ready to respond at any time—for example, using a voice command to launch a music playlist.

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Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems

Tensilica Vision Q7 DSP enables Light’s Clarity Depth Perception Platform to power next-generation ADAS systems with 10X greater performance than quad-core CPU REDWOOD CITY and SAN JOSE, Calif., January 13, 2022 – Light™ and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Light has deployed the Cadence® Tensilica® Vision Q7 DSP for use in

Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems Read More +

Cadence Demonstration of Vision and AI Applications on Tensilica-based Platforms

Amol Borkar, Senior Product Marketing Manager for Vision and AI DSPs at Cadence, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Borkar demonstrates various vision and AI applications, including real-time examples of driver monitoring, automotive perception, 6DoF SLAM and semantic segmentation, running on Tensilica processor-

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Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform

New Tensilica AI engine boosts performance and AI accelerators provide a turnkey solution for consumer, mobile, automotive and industrial AI SoC designs Highlights: Domain-specific, extensible and configurable AI platform built upon mature, volume production-proven Tensilica architecture Industry-leading performance and energy efficiency for on-device AI applications Comprehensive, common AI software addresses all target markets Low-, mid-

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“Vision and AI DSPs for Ultra-High-End and Always-On Applications,” a Presentation from Cadence

Pulin Desai, Product Marketing Group Director at Cadence Design Systems, presents the “Vision and AI DSPs for Ultra-High-End and Always-On Applications” tutorial at the May 2021 Embedded Vision Summit. The number and resolution of image sensors continue to increase in mobile, AR/VR, automotive, drone, mobile, and robotics platforms, which also use a mix of other

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Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications

Vision Q8 and Vision P1 DSPs Broaden Support for Automotive, Mobile and Consumer Markets SAN JOSE, Calif., April 22, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today expanded its popular Tensilica® Vision DSP product family with the debut of two new DSP IP cores for embedded vision and AI. Packing an industry-leading 3.8 tera operations per

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications Read More +

“Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases,” a Presentation from Cadence

Pulin Desai, Vision and AI Product Marketing Group Director at Cadence, presents the “Cadence Tensilica Edge AI Processor IP Solutions for Broad Market Use Cases” tutorial at the September 2020 Embedded Vision Summit. In this talk, Desai presents the full range of Cadence Tensilica edge AI processing solutions. These silicon IP-based solutions serve markets from

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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