Ceva

CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture

3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X Targets broad use of AI/ML in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute LAS VEGAS, Jan. 6, 2022 /PRNewswire/ — Consumer Electronics Show  – CEVA, Inc. (NASDAQ: CEVA), […]

CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture Read More +

ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems

CEVA-BX1 DSP powers audio/voice workloads in ASPEED’s AST1230 smart camera SoC; CEVA ClearVox voice front-end software is available to ASPEED’s customers to address most challenging multi-microphone conferencing use cases LAS VEGAS, Jan. 3, 2022 /PRNewswire/ — Consumer Electronics Show – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated

ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems Read More +

CEVA SensPro™ Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)

Functional safety-certified DSP and comprehensive software development kit is ideal for the development of low power automotive sensor fusion SoCs to process and fuse data from cameras, radar, lidar and more for autonomous driving and advanced driver assistance systems (ADAS) applications Rockville, MD, November 23, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless

CEVA SensPro™ Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic) Read More +

Nextchip Demonstration of Efficient Driver Monitoring for Automotive Cameras

Jessie Lee, General Manager of Technical Marketing at Nextchip, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Lee demonstrates efficient driver monitoring for automotive cameras. In this demonstration, Nextchip, in collaboration with PathPartner Technology, presents a driver monitoring system (DMS) solution based on its ADAS

Nextchip Demonstration of Efficient Driver Monitoring for Automotive Cameras Read More +

“SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices,” a Presentation from CEVA

Gil Abraham, Director of Business Development in the Vision and AI Business Unit at CEVA, presents the “SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices” tutorial at the May 2021 Embedded Vision Summit. Contextual awareness is the ability of a system to gather information about its

“SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices,” a Presentation from CEVA Read More +

CEVA to Acquire Intrinsix Corp, Expanding its Offering to Include Full Turnkey IP Platforms

Extends CEVA’s market reach into the sustainable aerospace & defense markets Increases CEVA’s revenue and royalty opportunity by combining IP, software and chip development for full turnkey IP platforms Expands CEVA’s IP portfolio with secure processor IP and interface IP for heterogeneous SoCs targeting IoT markets Rockville, MD., – May 10, 2021  – CEVA, Inc.

CEVA to Acquire Intrinsix Corp, Expanding its Offering to Include Full Turnkey IP Platforms Read More +

CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software

CEVA’s versatile and highly precise sensor fusion solution ensures an optimum customer experience in diverse consumer electronics and industrial markets SANTA CLARA, Calif. – April 28, 2021  – Based on its recent analysis of the global sensor fusion for the consumer electronics market, Frost & Sullivan recognizes CEVA, Inc. with the 2021 Global Company of

CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software Read More +

CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots

Robust and precise dead reckoning software offers cost-reduced alternative to expensive camera or LIDAR based systems for indoor robot navigation by fusing sensor data from optical sensors, IMU sensors and wheel encoders Rockville, MD, March 24, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today unveiled the

CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots Read More +

Home Surveillance and Security Without the Hassle

Fisheye dewarping with no need to install an app: this solution works directly with the WebGL API and on popular browsers for computers and mobile devices, as long as they support HTML5. Convenience and ease-of-use should be watchwords for the development of all products, yet many of them stumble right out of the blocks by

Home Surveillance and Security Without the Hassle Read More +

CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family

SensPro2™ delivers up to 6X DSP performance improvement in computer vision, 2X AI inferencing improvement and 20% lower power compared to 1st generation SensPro, at the same process node New, low power, entry-level SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and

CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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