The Edge AI and Vision Alliance 2025 CES Directory for game-changing computer vision and AI technologies Many Alliance Member companies will be showing off the latest building-block technologies that enable new capabilities for machines that see! CES is huge so we’ve created a handy checklist of these companies and where to find them including how […]
Alliance Members at 2025 CES Read More +
James Wang, president of eYs3D Microelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the September 2024 Edge AI and Vision Alliance Forum. Specifically, Wang demonstrates the company’s stereo camera and AI SoC with edge processing capability, and computer vision object detection models.
May 30, 2024 – eYs3D Microelectronics, with years of expertise in the fields of 3D sensing and computer vision, is a subsidiary of Etron Tech (TPEx: 5351). It has recently launched SenseLink, a multi-camera sensing system chip designed to enhance visual AI sensing capabilities. This technology utilizes advanced sensor fusion techniques to integrate data from
New AI-dedicated eCV series SoCs with ARM-based CPUs elevate AI capabilities for advanced autonomous robots, smart home, and industrial IoT solutions; launch is key milestones for brand as it embraces “AI+” concept and expands offering LAS VEGAS, Nev. and TAIPEI, Jan. 5, 2024 /PRNewswire/ — Known as a leader in 3D sensing and computer vision semiconductors under
CES 2024: eYs3D’s New Edge AI Chips Transforming Computer Vision for Robotics Read More +
The Platform-as-a-Service Uses SoM (System on Module) with the New 4 Multi-Core ARM CPU and 4.6 TOPS AI Data Processor to Speed Design LAS VEGAS and TAIPEI, Taiwan, Jan. 3, 2023 /PRNewswire/ — eYs3D Microelectronics, a subsidiary of Etron Technology (TPEx: 5351. TW), a subsidiary of Etron Technology (TPEx: 5351. TW), launched at CES a state-of-the-art computer vision development
eYs3D Launches One-stop XINK Development Platform for Vision-equipped Robots Read More +
Companies will demonstrate 3D depth vision through stereo cameras fusion for fast-motion object tracking in AIoT and autonomous guided robots and industrial devices Reference designs leverage ST’s high-performance, near-infrared, global-shutter image sensors to ensure best quality depth sensing and point-cloud creation 02 Jan 2023 | Geneva, Switzerland, and Taipei, Taiwan | STMicroelectronics (NYSE: STM), a
James Wang, Technical General Manager at eYs3D Microelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Wang demonstrates stereo vision for robotic automation and depth sensor fusion. Depth-sensing technology is now being widely adopted commercially in various consumer and industrial products. It’s commonly recognized that
eCapture™️ Cameras leverage eYs3D stereo vision technology and high-performance vision processor in this new line of devices SANTA CLARA, CA / ACCESSWIRE / August 23, 2021 / eCapture, a brand focused on developing technology for the growing computer vision market, today is introducing the smallest form factor stereoscopic 3D depth sensing camera. The new LifeSense™
El Dorado Hills, CA — June 28, 2021 — Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, and eYs3D Microelectronics, the image processor solution provider enabling enhanced 3D computer vision for edge AI, today announced a reference design for the Blaize Pathfinder P1600 SoM (system on a module). The Blaize Pathfinder P1600
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596
