STMicroelectronics

STMicroelectronics and Qualcomm Enter Strategic Collaboration in Wireless IoT

Strategic collaboration will pair STMicroelectronics’ market-leading STM32 microcontroller ecosystem and Qualcomm’s world-leading wireless connectivity solutions. Seamless integration into existing STM32 developer ecosystem to allow simple, fast, and cost-effective design of next-gen industrial and consumer IoT applications augmented by edge AI. Oct 1, 2024 – Geneva and San Diego – STMicroelectronics (NYSE: STM), a global semiconductor leader […]

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Dive Into the World’s Largest Cinema Image Sensor, Developed for Big Sky, the Ultra-high-resolution Camera System Capturing Content for Sphere

This blog post was originally published at STMicroelectronics’ website. It is reprinted here with the permission of STMicroelectronics. Imagine a movie experience where the screen melts away, transporting you directly into the heart of the action. This immersive feat is now a reality at Sphere, a next-generation entertainment medium in Las Vegas that measures 366

Dive Into the World’s Largest Cinema Image Sensor, Developed for Big Sky, the Ultra-high-resolution Camera System Capturing Content for Sphere Read More +

Edge AI Suite and the ML Journey: The First Step on the Intelligent Edge Adventure

This blog post was originally published at STMicroelectronics’ website. It is reprinted here with the permission of STMicroelectronics. To make machine learning at the edge more accessible, ST launched the ST Edge AI Suite, a repository of free software tools, use cases, and documentation to help developers create AI for the Intelligent Edge, regardless of

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STMicroelectronics Demonstration of RGB and Depth Fusion with a 0.5Mpixel Indirect ToF Sensor

Phillippe Legeard, Imaging Applications and Customer Support Engineer at STMicroelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Legeard demonstrates his company’s first 0.5 Mpixel indirect 3D time-of-flight (ToF) sensor, the VD55H1. The low noise, low power VD55H1 die is manufactured on advanced backside-illuminated, stacked

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STMicroelectronics Reveals ST BrightSense Image Sensor Ecosystem for Advanced Camera Performance Everywhere

Enables quicker and smarter designs of compact power-efficient products for factory automation, robotics, AR/VR, and medical applications Geneva, Switzerland, July 3, 2024 – STMicroelectronics has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST BrightSense global-shutter image sensors. The ecosystem lets developers of mass-market industrial and

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MEMS Studio: Software Inspired Solution to Make Machine Learning on Sensors Even More Approachable

This blog post was originally published at STMicroelectronics’ website. It is reprinted here with the permission of STMicroelectronics. MEMS Studio now supports ST’s intelligent sensor processing units (ISPUs) like the ISM330ISN and ISM330IS. The tool is ST’s most extensive visualization, evaluation, profiling, processing, and optimization software for machine learning applications running on our sensors. It

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STMicroelectronics Releases Energy-efficient Autonomous Inertial Measurement Unit with Industrial Product Longevity

Targets vibration sensing and motion tracking in industrial and robotics applications Geneva, Switzerland, June 5, 2024 – The STMicroelectronics ISM330BX 6-axis inertial measurement unit (IMU) combines edge-AI processing, an analog hub for sensor expansion, and ST’s Qvar electric charge variations sensing with product-longevity assurance for energy-efficient industrial sensing and motion tracking applications. The IMU contains

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STMicroelectronics Extends Edge-AI Sensor Family with Inertial Module for Intensive Movement Analysis

Enables longer battery runtime in wearables, trackers, and activity monitoring Geneva, Switzerland, April 18, 2024 – The LSM6DSV32X 6-axis inertial module (IMU) from STMicroelectronics has a large accelerometer full-scale range of 32g and 4000 degrees-per-second (dps) gyroscope to measure intensive movements and impacts, including freefall height estimation. Ready to drive future generations of edge-AI applications,

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Digi International to Unveil the New Digi ConnectCore MP25 System-on-module for Next-gen Computer Vision Applications at Embedded World 2024

Versatile, wireless and secure system-on-module based on the STMicroelectronics STM32MP25 processor improves efficiency, reduces costs and enables edge processing for innovative new devices MINNEAPOLIS, April 4, 2024 – Digi International (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) connectivity products and services, is poised to introduce the wireless and highly power-efficient

Digi International to Unveil the New Digi ConnectCore MP25 System-on-module for Next-gen Computer Vision Applications at Embedded World 2024 Read More +

STMicroelectronics Expands into 3D Depth Sensing with Latest Time-of-flight Sensors

Building on a leading position in direct Time-of-Flight sensors, with two billion FlightSenseâ„¢ devices sold, ST reveals new direct and indirect Time-of-Flight sensors for key applications like camera assist, virtual reality, 3D webcam, robotics and smart buildings Market-first true all-in-one dToF LiDAR module with up to 2.3k zones, targets smartphone camera-assist and AR/VR applications The

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PO Box #4446
Walnut Creek, CA 94596

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