This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Intelligence’s memory analyst, Mike Howard delivers today a snapshot on the memory pricing, with a special focus on DRAM. Mike invites you to dive deep into the memory market and get […]
Memory Pricing Set to Take Off in 2H 2023 Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. ECTC explores integration, bonding technologies and new materials in search of advanced packaging for the AI age Advanced packaging is a linchpin for the semiconductor industry which is wrestling with integrating multiple
Innovation Beyond Moore’s Law: Advanced Packaging Explores New Frontiers Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Geopolitical tensions are making advanced semiconductor packaging increasingly crucial… OUTLINE The Advanced Packaging (AP) market, valued at US$44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022
Advanced Semiconductor Packaging: A New Geopolitical Battleground Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Record breaking results announced by NVIDIA have fuelled speculation of an AI goldrush. Days later, the company introduced platforms for generative AI at Computex 2023. Yole Group and its entities, Yole SystemPlus
NVIDIA Sets the Pace for the AI Era Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. As recently stressed by Yole Intelligence, part of Yole Group, the automotive semiconductor sensor market is expected to reach US$14 billion in 2028, with a 10% CAGR during 2022-28. By integrating a
Automotive: Sensor Sprawl is On the Rise Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Co-packaged optics (CPO) has gained attention recently due to its power efficiency in datacenters. While most leading proponents of CPO targeting networking applications have discontinued CPO programs due to macroeconomic headwinds, the
Leveraging Optical Chip-to-chip Connectivity to Unleash the Complete Potential of AI Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. At the core of electrification and ADAS lies the semiconductor technologies. OUTLINE The automotive semiconductor sensor market is expected to reach US$14 billion in 2028, with a 10% CAGR 22-28. Electrification and
Accelerating Automotive Transformation: The Power of Semiconductor Sensors Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The semiconductor memory industry has long been a strategic priority for China’s economic development. Chinese companies purchase more than 30% of the NAND and DRAM products manufactured by global IDMs, while China’s
Semiconductor Memory: China’s Ambition Shows No Signs of Slowing Down Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Smartphone Application Procession Unit (APU) vendors earned $8.3B revenue in Q4-2022. Products like the Snapdragon 8 Generation 2 help Qualcomm maintain their leadership position in this APU market. This full reverse costing
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The idea of a multi-chip product has been around for some time, for the purposes of achieving a higher functioning system made up of smaller components. We have the mainframe CPU IBM
Chiplets: Why Now? Read More +
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