Yole Group

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The advanced packaging market growth is primarily driven by high-performance computing (HPC) and generative AI megatrends. The advanced packaging revenue is projected to grow at a CAGR of 12.9%, increasing from US$39.2 […]

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. New plants, emerging outsourced semiconductor assembly and test (OSAT), and new consortia are changing the dynamics of the supply chain. OUTLINE The advanced packaging (AP) market is expected to have a CAGR23-29

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Deep dive in supply chain and its bottleneck and resilience. Which company takes benefits of generative AI and who is missing? Datacenter GPU and AI ASIC revenue could reach $156B by 2025,

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Power and processor-hungry AI set to drive next stage of chip development – Generative artificial intelligence (AI) is redefining the value of work, and its exponential need for performance is driving demand

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The current AI/HPC demand has brought high-end performance packaging to the spotlight. OUTLINE The high-end packaging market is projected to exceed US$28 billion by 2029, with a CAGR 23-29 of 37%. TSMC