Summit 2024

Lattice Semiconductor Demonstration of a Low-latency Edge AI Sensor Bridge for NVIDIA’s Holoscan

Kambiz Khalilian, Director of Strategic Initiatives and Ecosystem Alliances for Lattice Semiconductor, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Khalilian demonstrates a low-latency edge AI sensor bridge solution for NVIDIA’s Holoscan. The Lattice FPGA-based Holoscan Sensor Bridge enables high-throughput and low-latency sensor aggregation and […]

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Lumotive Demonstration of a Sensor Hub for LiDAR, Radar and Camera Fusion

Kevin Camera, Vice President of Product for Lumotive, demonstrates the company’s latest edge AI and vision technologies and products in Lattice Semiconductor’s booth at the 2024 Embedded Vision Summit. Specifically, Camera demonstrates a sensor hub for concurrently fusing together and processing data from multiple sources: Velodyne’s VLP-16 LiDAR, Lumotive’s M30 solid state LiDAR, Texas Instruments’

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e-con Systems Demonstration of Its Advanced Camera Solutions

Gomathi Sankar Paramasivan, Head of the Industrial Camera Business Unit at e-con Systems, demonstrates the company’s latest edge AI and vision technologies and products in Lattice Semiconductor’s booth at the 2024 Embedded Vision Summit. Specifically, Paramasivan demonstrates his company’s CAM85_CUOAGX and See3CAM50_CUG advanced camera solutions based on Lattice Semiconductor FPGAS. The showcased cameras are powered

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Flex Logix Demonstration of Enabling High Performance AI Inference At the Edge

Jeremy Roberson, Technical Director and Software Architect for AI and Machine Learning at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Roberson demonstrates the power, performance, and area (PPA) capabilities of his company’s InferX IP by using it to run a state-of-the-art object

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Flex Logix Overview of SoC Adaptability and Algorithm Acceleration Using Embedded FPGA Technology

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Bethurem discusses how his company’s embedded FPGA technology can bring adaptability and algorithm acceleration capabilities to SoCs. Building SoCs is becoming increasingly challenging. To create

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Flex Logix Overview of How to Enable Long-lasting Security For SoCs with Embedded FPGA Technology

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Bethurem discusses how his company’s embedded FPGA technology can enable long-lasting security for SoCs. Considering current and future security landscapes and their associated challenges, providing

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DEEPX Demonstration of Its DX-M1 AIoT Booster

Taisik Won, the President of DEEPX USA, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Won demonstrates the company’s AIoT Booster, the DX-M1. The DX-M1 is DEEPX’s flagship AI chip, meticulously engineered for seamless integration into any AIoT application. This cutting-edge chip can simultaneously process

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DEEPX Demonstration of Its DX-V1 and DX-V3 AI Vision Processors

Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s DX-V1 and DX-V3 AI vision processors. The DX-V1 and DX-V3 are AI enabler chips for vision systems. The DX-V1 is a standalone edge AI chip that can

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DEEPX Demonstration of Its DX-H1 Green AI Computing Card

Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s latest innovation, the DX-H1 Green AI Computing Card. The DX-H1 is designed for eco-friendly data centers, delivering 10 times better power and cost efficiency than GPGPU solutions.

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Cadence Demonstration of a Large Vision Model for Generative AI on the Tensilica Vision P6 DSP

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision P6 DSP for the latest generative AI (GenAI) applications. The Vision P6 DSP is a

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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