Memory

For more information, visit https://www.idtechex.com/en/research-report/hardware-for-hpc-and-ai-2025-2035-technologies-markets-forecasts/1058. HPC hardware market to reach US$581 billion by 2035 at a CAGR of 13.6%. This report examines the high-performance computing (HPC) and AI hardware markets. It provides an overview of the overall HPC market in the exascale era, including analysis of major supercomputers like El Capitan. Detailed overview of technologies […]

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex. Challenges include developing the right materials and innovating packaging manufacturing techniques. IDTechEx‘s “Materials and Processing

For more information, visit https://www.idtechex.com/en/research-report/chiplet-technology-2025/1041. In the rapidly evolving world of semiconductors, chiplet technology is emerging as a groundbreaking approach that addresses many of the challenges faced by traditional monolithic System-on-Chip (SoC) designs. As Moore’s Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density.