Memory

Demand for HBM to Grow 15-fold by 2035 for HPC and AI

Parallel computer architectures, such as those deployed for modern high-performance computing (HPC) and artificial intelligence (AI) workloads, frequently encounter memory bottlenecks that limit performance, known as the ‘memory wall’. Historically, this has stemmed from the advances in processor performance (e.g. CPUs, GPUs, and other AI accelerators) outpacing developments in memory performance. This poses significant challenges […]

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Passenger Car ADAS Market 2025-2045: Technology, Market Analysis, and Forecasts

For more information, visit https://www.idtechex.com/en/research-report/passenger-car-adas-market-2025-2045-technology-market-analysis-and-forecasts/1080. Global L2+/L3 feature adoption will exceed 50% by 2035. Over the past few years, Advanced Driver Assistance Systems (ADAS) have become a core competitive factor in the passenger vehicles market. In particular, “Level 2+” has emerged as a term describing advanced Level 2 ADAS with more sophisticated capabilities, such as

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The Rise of Chiplets and Simplified Interconnectivity

Smaller and more compact designs with simplified structures can be achieved with chiplet technology. IDTechEx‘s report, “Chiplet Technology 2025-2035: Technology, Opportunities, Applications“, unpacks the benefits and challenges of developing chiplet technology compared with competing semiconductor designs and their best-suited applications. Chiplet characteristics Chiplets allow for GPU, CPU, and IO components to become miniaturized to suit

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$1 Trillion by 2030: The Semiconductor Devices Industry is On Track

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Entering a new growth cycle, the surge in the semiconductor industry is driven by the rise of generative AI processors and HBM[1] OUTLINE Market evolution: with a $672 billion market in 2024[2],

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Advanced Packaging: How AI is Revolutionizing the Game

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The growth of the AI server market is driving the adoption of 2.5D/3D packaging technologies. 2.5D & 3D interconnect types for the high-end performance packaging market: Revenue is expected to grow with

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AI Chips Take Center Stage at CES

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The 2025 edition of the world’s largest consumer electronics conference showcased the latest semiconductors for artificial intelligence applications The CES 2025 conference in Las Vegas showcased the latest semiconductor innovations, offering some

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Which AI Hardware Will Rise Above in the Wake of Competing AI Models?

IDTechEx forecasts for yearly unit sales of HPC and AI GPUs and CPUs between 2024 and 2035. The grip of AI has continued to hold, with strong competition to develop more powerful AI models, active innovation in the semiconductor industry, and continued investment in the High-Performance Computing (HPC) data center market. Artificial Intelligence has been

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CPUs, GPUs, and AI: Exploring High-performance Computing Hardware

IDTechEx‘s latest report, “Hardware for HPC and AI 2025-2035: Technologies, Markets, Forecasts“, provides data to show that the use of graphics processing units (GPUs) within high performance computing (HPC) has been increasingly adopted since the introduction of generative AI and large language models, as well as advanced memory, storage, networking, and cooling technologies. Drivers for

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HPC Hardware Market to Grow at 13.6% CAGR to 2035

HPC systems, including supercomputers, outclass all other classes of computing in terms of calculation speed by parallelizing processing over many processors. HPC has long been an integral tool across critical industries, from facilitating engineering modeling to predicting the weather. The AI boom has intensified development in the sector, growing the capabilities of hardware technologies, including

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