The premier event for product creators incorporating computer vision and edge AI in products and applications SANTA CLARA, Calif., April 29, 2024 /PR Newswire/ — The Edge AI and Vision Alliance, a worldwide industry partnership, today announced the full program for the 2024 Embedded Vision Summit, taking place May 21-23 at the Santa Clara Convention […]
Semiconductor packaging can be incredibly boring. That said, advanced packaging is a key to every high-complexity semiconductor – both on and off the planet. Nvidia, AMD, and Intel have all utilized chiplets and advanced packages for their latest AI/ML accelerators and processors. Without 2.5D and 3D design and assembly techniques, these and many other essential
NIST Advanced Packaging Summit Read More +
Kerry Shih of GenAI Nerds interviews Jeff Bier, Founder of the Edge AI and Vision Alliance, and Phil Lapsley, the Alliance’s Vice President of Business Development, about the opportunities and trends for generative AI at the edge. Shih, Bier and Lapsley discuss topics such as: Where we are in the generative AI hype cycle What
Edge AI and Vision Alliance Conversation with GenAI Nerds on Generative AI At the Edge Read More +
Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers NUREMBERG, Germany, April 10, 2024 (GLOBE NEWSWIRE) — Embedded World — Micron Technology, Inc. (Nasdaq: MU), today announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™,
The Edge AI and Vision Alliance’s Jeff Bier discusses how advances in embedded systems’ basic building blocks are fundamentally changing their nature. The Ojo-Yoshida Report is launching the second in our Dig Deeper video podcast series, this issue focusing on “Embedded Basics.” Our guest for the inaugural episode is Jeff Bier, founder, Edge AI and Embedded Vision
What Changed From VCRs to Software-defined Vision? Read More +
Embedded World, April 9-11 2024, Hall 3, Booth 339 Taipei, Taiwan and Nuremberg, Germany, 2nd April 2024 — Advantech, a leading provider of AIoT platforms and services, today announced its participation at Embedded World 2024, a trade show taking place in Nuremberg April 9-11, 2024. Visitors will find Advantech’s 160 m2 booth in Hall 3,
Advantech to Showcase Industry-leading AIoT Solutions at Embedded World Read More +
The tech industry’s self-congratulatory analogy of AI with electricity “is not absurd, but it’s too flawed to be useful,” says historian Peter Norton. What’s at stake: In Silicon Valley, power prevails. In the short run, if your business and technology have the power to make money, move the market, and change the rules, you won’t
Where Nvidia’s Huang Went Wrong on Thomas Edison vs. AI Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. These market segments generated $296 billion in semiconductor revenue in 2023, with an expected CAGR2023-2030 of 2.1% OUTLINE Semiconductor content will remain stable at ~35% for the mobile and computing subsegments while
The Semiconductor Industry: Mobile and Consumer are Its Beating Heart Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The demands and complex requirements of the semiconductor industry were a key driver, transformation enabler, and innovation-inducer of the advanced packaging industry, including the market of advanced IC substrates. While the advanced
AI Accelerators and HPC: Latest Innovations in the Advanced IC Substrates Market Read More +
Micron HBM3E helps reduce data center operating costs by consuming about 30% less power than competing HBM3E offerings BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and storage solutions, today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution. Micron’s 24GB 8H
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596
