Memory

AI Accelerators and HPC: Latest Innovations in the Advanced IC Substrates Market

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The demands and complex requirements of the semiconductor industry were a key driver, transformation enabler, and innovation-inducer of the advanced packaging industry, including the market of advanced IC substrates. While the advanced […]

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Micron Commences Volume Production of Industry-leading HBM3E Solution to Accelerate the Growth of AI

Micron HBM3E helps reduce data center operating costs by consuming about 30% less power than competing HBM3E offerings BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and storage solutions, today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution. Micron’s 24GB 8H

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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