Processors

Understanding What the Machines See: State-of-the-art Computer Vision at CVPR 2024

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Qualcomm’s accepted papers, demos and workshops at CVPR 2024 showcase the future of generative AI and perception The Computer Vision and Pattern Recognition Conference (CVPR) 2024 begins on Monday, June 17, and Qualcomm Technologies is excited to […]

Understanding What the Machines See: State-of-the-art Computer Vision at CVPR 2024 Read More +

“Image Signal Processing Optimization for Object Detection,” a Presentation from Nextchip

Young-Jun Yoo, Executive Vice President at Nextchip, presents the “Image Signal Processing Optimization for Object Detection” tutorial at the May 2024 Embedded Vision Summit. This talk delves into the challenges and optimization strategies in image signal processing (ISP) for enhancing object detection in advanced driver-assistance systems (ADAS). Through real-world examples,… “Image Signal Processing Optimization for

“Image Signal Processing Optimization for Object Detection,” a Presentation from Nextchip Read More +

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America

Hussein Osman, Segment Marketing Director at Lattice Semiconductor, and Richard Crisp, Vice President and Chief Scientist at Etron Technology America, co-presents the “Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs” tutorial at the May 2024 Embedded Vision Summit. Attaining the lowest power,… “Squeezing the Last Milliwatt and

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America Read More +

Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024

Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements 18 Jun 2024 – At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification

Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024 Read More +

TOPS of the Class: Decoding AI Performance on RTX AI PCs and Workstations

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. What is a token? Why is batch size important? And how do they help determine how fast AI computes? Editor’s note: This post is part of the AI Decoded series, which demystifies AI by making the technology

TOPS of the Class: Decoding AI Performance on RTX AI PCs and Workstations Read More +

“Maximize Your AI Compatibility with Flexible Pre- and Post-processing,” a Presentation from Flex Logix

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, presents the “Maximize Your AI Compatibility with Flexible Pre- and Post-processing” tutorial at the May 2024 Embedded Vision Summit. At a time when IC fabrication costs are skyrocketing and applications have increased in complexity, it is important to… “Maximize Your AI Compatibility with

“Maximize Your AI Compatibility with Flexible Pre- and Post-processing,” a Presentation from Flex Logix Read More +

“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence

Amol Borkar, Product Marketing Director at Cadence, presents the “Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors” tutorial at the May 2024 Embedded Vision Summit. From ADAS to autonomous vehicles to smartphones, the number and variety of sensors used in edge devices is increasing: radar, LiDAR, time-of-flight… “Addressing Tomorrow’s Sensor Fusion and

“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence Read More +

“Temporal Event Neural Networks: A More Efficient Alternative to the Transformer,” a Presentation from BrainChip

Chris Jones, Director of Product Management at BrainChip, presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit. The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent… “Temporal Event Neural Networks: A

“Temporal Event Neural Networks: A More Efficient Alternative to the Transformer,” a Presentation from BrainChip Read More +

How Edge Devices Can Help Mitigate the Global Environmental Cost of Generative AI

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Exploring the role of edge devices in reducing energy consumption and promoting sustainability in AI systems The economic value of generative artificial intelligence (AI) to the world is immense. Research from McKinsey estimates that generative AI could add the

How Edge Devices Can Help Mitigate the Global Environmental Cost of Generative AI Read More +

“Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” a Presentation from BDTI

Phil Lapsley, Co-founder and Vice President of BDTI, presents the “Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!)” tutorial at the May 2024 Embedded Vision Summit. For over 30 years, BDTI has provided engineering, evaluation and advisory services to processor suppliers and companies… “Silicon Slip-ups: The Ten Most

“Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” a Presentation from BDTI Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top