Processors

“SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices,” a Presentation from CEVA

Gil Abraham, Director of Business Development in the Vision and AI Business Unit at CEVA, presents the “SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices” tutorial at the May 2021 Embedded Vision Summit. Contextual awareness is the ability of a system to gather information about its […]

“SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices,” a Presentation from CEVA Read More +

“Vision and AI DSPs for Ultra-High-End and Always-On Applications,” a Presentation from Cadence

Pulin Desai, Product Marketing Group Director at Cadence Design Systems, presents the “Vision and AI DSPs for Ultra-High-End and Always-On Applications” tutorial at the May 2021 Embedded Vision Summit. The number and resolution of image sensors continue to increase in mobile, AR/VR, automotive, drone, mobile, and robotics platforms, which also use a mix of other

“Vision and AI DSPs for Ultra-High-End and Always-On Applications,” a Presentation from Cadence Read More +

Tech Alert: Navigating Driver Privacy and Safety of Electric Vehicles, Self-Driving Vehicles

Aliso Viejo, Calif. – July 28, 2021 – A growing number of connected electric vehicles, as well as the evolution of self driving and automated vehicles are putting a greater demand on processing power. New technologies are advancing rapidly with the introduction of new processing methods, according to experts at BrainChip Holdings Ltd (ASX: BRN),

Tech Alert: Navigating Driver Privacy and Safety of Electric Vehicles, Self-Driving Vehicles Read More +

Shortcut to Series Production: Modular Maivin i.MX 8M Plus AI Vision Kit from AU-Zone, Toradex and Vision Components

July 28, 2021 – For proof of concept, rapid prototyping and small series production, AU-Zone and Toradex, working in close cooperation with Vision Components, have developed the modular Maivin i.MX 8M Plus AI Vision Kit. The developer kit is based on a Toradex Verdin i.MX 8M Plus System-on-Module and a carrier board, which AU-Zone designed

Shortcut to Series Production: Modular Maivin i.MX 8M Plus AI Vision Kit from AU-Zone, Toradex and Vision Components Read More +

Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution

New Offering Enables Low-Power Voice-Controlled Operation of Embedded Vision AI Systems in IoT and Edge Applications TOKYO, Japan, and Irvine, Calif., July 28, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Syntiant Corp., a deep learning chip technology company advancing low-power intelligent voice and sensor processing in edge devices,

Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution Read More +

“A Mask Detection Smart Camera Using the NVIDIA Jetson Nano: System Architecture and Developer Experience,” a Presentation from BDTI and Tryolabs

Evan Juras, Computer Vision Engineer at BDTI, and Braulio Ríos, Machine Learning Engineer at Tryolabs, co-present the “A Mask Detection Smart Camera Using the NVIDIA Jetson Nano: System Architecture and Developer Experience” tutorial at the May 2021 Embedded Vision Summit. MaskCam is a prototype reference design for a smart camera that counts the number of

“A Mask Detection Smart Camera Using the NVIDIA Jetson Nano: System Architecture and Developer Experience,” a Presentation from BDTI and Tryolabs Read More +

Maxim Integrated Teams with Xailient to Provide World’s Fastest and Lowest-Power IoT Face Detection

MAX78000 AI microcontroller and Xailient’s Detectum neural network detects and localizes faces in video and images at just 12ms per inference SAN JOSE, Calif., July 27, 2021 /PRNewswire/ — Maxim Integrated Products, Inc. (NASDAQ: MXIM) and Xailient Inc., a company focused on artificial intelligence (AI) for the edge, today announced that Maxim Integrated’s MAX78000 ultra-low

Maxim Integrated Teams with Xailient to Provide World’s Fastest and Lowest-Power IoT Face Detection Read More +

MediaTek Introduces the Kompanio 1300T Platform to Enhance Premium Computing Experiences in Tablets

SoC provides personal computing devices with powerful performance and advanced 5G connectivity, multimedia and gaming technologies HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to

MediaTek Introduces the Kompanio 1300T Platform to Enhance Premium Computing Experiences in Tablets Read More +

Blaize, Leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth

Franklin Templeton and Temasek lead Blaize $71m Series D funding aimed at acceleration of AI Edge Computing and Automotive/EV product roadmap El DORADO HILLS, CA — July 27, 2021 — Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, today announced the close of a $71m Series D round of funding. Franklin Templeton,

Blaize, Leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth Read More +

STMicroelectronics Strengthens Support for Efficient Machine Learning in STM32Cube.AI Ecosystem

Geneva, July 26, 2021 – STMicroelectronics has expanded the variety of machine-learning techniques available to users of the STM32Cube.AI development environment, giving extra flexibility to solve classification, clustering, and novelty-detection challenges as efficiently as possible. In addition to enabling development of neural networks for edge inference on STM32* microcontrollers (MCUs), the latest STM32Cube.AI release (version

STMicroelectronics Strengthens Support for Efficient Machine Learning in STM32Cube.AI Ecosystem Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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