OpenFive Tapes Out SoC for Advanced AI/HPC Solutions on TSMC 5nm Technology
OpenFive HBM3 and Die-2-Die (D2D) interfaces combined with SiFive E76 RISC-V CPU core enable high performance chiplets and 2.5D based system-on-a-chip (SoC) designs. SAN MATEO, Calif. – April 13, 2021 – OpenFive, a leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the successful tape out of a high-performance SoC on TSMC’s N5 […]
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