Processors

“Deploying an Autonomous Valet Parking Solution with Cameras Using AI,” a Presentation from Nextchip and VADAS

James Kim, Marketing Team Leader at Nextchip, and Peter Lee, CEO of VADAS, co-present the “Deploying an Autonomous Valet Parking Solution with Cameras Using AI” tutorial at the May 2021 Embedded Vision Summit. In this talk, Nextchip’s Kim explains why his company targeted autonomous valet parking (AVP) with its newest APACHE6 SoC, and how Nextchip […]

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Chips&Media Expects a Supercycle in Semiconductors This Year

Seoul, South Korea – August 05, 2021 – Chips & Media, which focuses on video codecs, computer vision (super-resolution), and semiconductor hardware intellectual property (IP) reported the 2021 performance today. Chips&Media’s business activities, which earn 95% of its total earnings from exports, were restricted and limited in the first quarter of last year due to the

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“DepthAI: Embedded, Performant Spatial AI and Computer Vision,” a Presentation from Luxonis

Brandon Gilles, CEO of Luxonis, presents the “DepthAI: Embedded, Performant Spatial AI and Computer Vision” tutorial at the May 2021 Embedded Vision Summit. Performant spatial AI and CV enables human-like perception and real-time interaction with the world. But embedding performant spatial AI and CV into actual products is difficult, costly and time-consuming. DepthAI makes building

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“Flexible Machine Learning Solutions with Lattice FPGAs,” a Presentation from Lattice Semiconductor

Sreepada Hegade, Senior Manager for ML Software and Solutions at Lattice Semiconductor, presents the “Flexible Machine Learning Solutions with Lattice FPGAs” tutorial at the May 2021 Embedded Vision Summit. The ability to perform neural network inference in resource-constrained devices is fueling the growth of machine learning at the edge. But application solutions require more than

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“Productizing Edge AI Across Applications and Verticals: Case Study and Insights,” a Presentation from Hailo and NEC

Orr Danon, CEO of Hailo, and Tsvi Lev, Managing Director of the NEC Research Center Israel and Corporate Vice President of NEC, co-present the “What We Need to Transform Lives and Industries with On-Device AI, Cloud and 5G” tutorial at the May 2021 Embedded Vision Summit. As edge AI is growing across different markets and

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“SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices,” a Presentation from CEVA

Gil Abraham, Director of Business Development in the Vision and AI Business Unit at CEVA, presents the “SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices” tutorial at the May 2021 Embedded Vision Summit. Contextual awareness is the ability of a system to gather information about its

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“Vision and AI DSPs for Ultra-High-End and Always-On Applications,” a Presentation from Cadence

Pulin Desai, Product Marketing Group Director at Cadence Design Systems, presents the “Vision and AI DSPs for Ultra-High-End and Always-On Applications” tutorial at the May 2021 Embedded Vision Summit. The number and resolution of image sensors continue to increase in mobile, AR/VR, automotive, drone, mobile, and robotics platforms, which also use a mix of other

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Tech Alert: Navigating Driver Privacy and Safety of Electric Vehicles, Self-Driving Vehicles

Aliso Viejo, Calif. – July 28, 2021 – A growing number of connected electric vehicles, as well as the evolution of self driving and automated vehicles are putting a greater demand on processing power. New technologies are advancing rapidly with the introduction of new processing methods, according to experts at BrainChip Holdings Ltd (ASX: BRN),

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Shortcut to Series Production: Modular Maivin i.MX 8M Plus AI Vision Kit from AU-Zone, Toradex and Vision Components

July 28, 2021 – For proof of concept, rapid prototyping and small series production, AU-Zone and Toradex, working in close cooperation with Vision Components, have developed the modular Maivin i.MX 8M Plus AI Vision Kit. The developer kit is based on a Toradex Verdin i.MX 8M Plus System-on-Module and a carrier board, which AU-Zone designed

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Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution

New Offering Enables Low-Power Voice-Controlled Operation of Embedded Vision AI Systems in IoT and Edge Applications TOKYO, Japan, and Irvine, Calif., July 28, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Syntiant Corp., a deep learning chip technology company advancing low-power intelligent voice and sensor processing in edge devices,

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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