Processors

Imagination Launches Multi-core IMG Series4 NNA – The Ultimate AI Accelerator Delivering Industry-disruptive Performance for ADAS and Autonomous Driving

Offering the most responsive and power efficient neural network acceleration for next-generation automotive use cases London, England – 12th November 2020 – Imagination Technologies announces IMG Series4, its next-generation neural network accelerator (NNA) for advanced driver-assistance systems (ADAS) and autonomous driving. Series4 targets automotive industry-leading disruptors as well as Tier 1s, original equipment manufacturer (OEMS) […]

Imagination Launches Multi-core IMG Series4 NNA – The Ultimate AI Accelerator Delivering Industry-disruptive Performance for ADAS and Autonomous Driving Read More +

“Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision,” a Presentation from Intel

Tara K. Thimmanaik, Solutions Architect at Intel, presents the “Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision” tutorial at the September 2020 Embedded Vision Summit. As demand for smarter and more efficient manufacturing is growing, IoT technologies⁠—including sensors, edge devices, gateways, servers and the cloud⁠—are being used throughout the factory to compute deep learning analytics

“Smarter Manufacturing with Intel’s Deep Learning-Based Machine Vision,” a Presentation from Intel Read More +

CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC

Rockville, MD., – November 11, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC). “We are honored that Renesas, a world leading automotive semiconductor supplier, has selected our leading-edge DSP

CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC Read More +

“Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study,” a Presentation from Intel

Manas Pathak, Global AI Lead for Oil and Gas at Intel, presents the “Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study” tutorial at the September 2020 Embedded Vision Summit. The use of deep learning for automatic seismic data interpretation is gaining the attention of many researchers across the oil and gas industry. The

“Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study,” a Presentation from Intel Read More +

MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones

Dimensity 700 caters to growing consumer demand for 5G devices HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7nm SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of the Dimensity 700 to MediaTek’s Dimensity family of 5G chips gives

MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones Read More +

MediaTek Announces New MT8192 and MT8195 Chipsets Designed for Next Generation of Chromebooks

New chipsets to power premium and mainstream Chromebooks and enhance computing experiences HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its MT8192 and MT8195 chipsets for the next generation of Chromebooks. With the 7nm MT8192 for mainstream devices and the 6nm MT8195 for premium devices, brands can design powerful, sleek and lightweight Chromebooks that

MediaTek Announces New MT8192 and MT8195 Chipsets Designed for Next Generation of Chromebooks Read More +

AMD Unveils AMD Ryzen Embedded V2000 Processors with Enhanced Performance and Power Efficiency

AMD Ryzen Embedded V2000 Series processors deliver double the cores1, up to 2x the performance-per-watt2 and an estimated 15 percent IPC uplift3 over the previous generation SANTA CLARA, Calif. – 11/10/2020 AMD (NASDAQ: AMD) today launched a new product in its high-performance Embedded processor family, the AMD Ryzen™ Embedded V2000 Series processor. Built on the innovative 7nm

AMD Unveils AMD Ryzen Embedded V2000 Processors with Enhanced Performance and Power Efficiency Read More +

MediaTek Introduces i350 Edge AI Platform Designed for Voice and Vision Processing Applications

The low-power i350 brings reliable connectivity and advanced multimedia features to edge AI devices HSINCHU, Taiwan – October 13, 2020 – MediaTek today announced the i350, a highly integrated Edge AI platform with a dedicated APU (AI processor) and digital signal processor (DSP) for AIoT products that require vision and voice edge processing. The i350

MediaTek Introduces i350 Edge AI Platform Designed for Voice and Vision Processing Applications Read More +

OmniVision, Ambarella and Smart Eye Partner on Automotive Industry’s First Combined Driver Monitoring and Videoconferencing Camera Solution

Reference Design Combines OmniVision’s Dual-Mode Global Shutter Image Sensor for Both RGB and IR Imaging With Ambarella’s AI Vision Processor and Smart Eye’s AI DMS Software Algorithm SANTA CLARA, Calif. – Nov. 10, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, Ambarella, Inc. (Nasdaq: AMBA), an AI vision silicon company,

OmniVision, Ambarella and Smart Eye Partner on Automotive Industry’s First Combined Driver Monitoring and Videoconferencing Camera Solution Read More +

“Federated Edge Computing System Architectures,” a Presentation from Intel

Vaidyanathan Krishnamoorthy, Edge Inference Solutions Architect at Intel, presents the “Federated Edge Computing System Architectures” tutorial at the September 2020 Embedded Vision Summit. With ever-increasing amounts of video and other sensor data, and growing requirements for privacy and low latency, inferencing at the edge is increasingly attractive. But there are many ways to allocate and

“Federated Edge Computing System Architectures,” a Presentation from Intel Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top