New chipset enhances 5G smartphone experiences through advanced connectivity features and multi-core high performance technologies HSINCHU, Taiwan – Aug. 18, 2020 – MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek’s Dimensity series family. The 7nm Dimensity 800U chipset is designed for multi-core high performance and leading 5G+5G […]
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. This is the fourth post in the CUDA Refresher series, which has the goal of refreshing key concepts in CUDA, tools, and optimization for beginning or intermediate developers. The CUDA programming model provides an abstraction of GPU
CUDA Refresher: The CUDA Programming Model Read More +
At Architecture Day 2020, Intel Technical Leaders Showcase New Architectures and Innovations for the Intelligent Era At Intel, we truly believe in the potential of technology to enrich lives and change the world. This has been a guiding principle since the company was founded. It started with the PC era, when technology enabled the mass
Christine Cheng, co-chair of the inference benchmark working group at MLPerf and a senior machine learning optimization engineer at Intel, delivers the presentation “MLPerf: An Industry Standard Performance Benchmark Suite for Machine Learning” at the Edge AI and Vision Alliance’s July 2020 Edge AI and Vision Innovation Forum. Cheng explains how MLPerf’s inference benchmark suite
Song Han, Associate Professor in the Department of Electrical Engineering and Computer Science at MIT, delivers the presentation “Once-for-All DNNs: Simplifying Design of Efficient Models for Diverse Hardware” at the Edge AI and Vision Alliance’s July 2020 Edge AI and Vision Innovation Forum. Han shares his group’s latest research on the automated generation of deep
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. The NVIDIA A100, based on the NVIDIA Ampere GPU architecture, offers a suite of exciting new features: third-generation Tensor Cores, Multi-Instance GPU (MIG) and third-generation NVLink. Ampere Tensor Cores introduce a novel math mode dedicated for AI
Accelerating TensorFlow on NVIDIA A100 GPUs Read More +
MediaTek’s latest 5G SoC pairs big core performance with extreme energy efficiency HSINCHU, Taiwan – July 23, 2020 – MediaTek today announced the Dimensity 720, its latest 5G SoC that will give consumers access to premium 5G experiences on mid-tier smartphones. The Dimensity 720, is part of MediaTek’s 5G chipset family that includes range of chipsets
Jay Cormier, CEO of Eyedaptic, Vaibhav Ghadiok, VP of Engineering at Hayden AI, Chuck Gershman, CEO and Co-founder of Owl Autonomous Imaging, Gregor Horstmeyer, Head of Product at Ramona Optics, and Owen Nicholson, CEO of SLAMcore, deliver their Vision Tank presentations at the July 16, 2020 online finalist competition round. The Vision Tank introduces companies
2020 Vision Tank Start-Up Final Competition Round Read More +
I am delighted to introduce our second-generation IPU platform with greater processing power, more memory and built-in scalability for handling extremely large Machine Intelligence workloads. The IPU-Machine M2000 is a plug-and-play Machine Intelligence compute blade that has been designed for easy deployment and supports systems that can grow to massive scale. The slim 1U blade
Introducing 2nd Generation IPU Systems For AI At Scale Read More +
Upgraded Flagship Mobile Platform to Power Second Half 2020 Commercial Smartphones Jul 8, 2020 – SAN DIEGO – Qualcomm Technologies, Inc. unveiled the Qualcomm® Snapdragon™ 865 Plus 5G Mobile Platform, a follow-on to the flagship Snapdragon 865 that has powered more than 140 devices (announced or in development) – the most individual premium-tier designs powered
Qualcomm Announces Snapdragon 865 Plus 5G Mobile Platform Read More +
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