Processors

New AI SDKs and Tools Released for NVIDIA Blackwell GeForce RTX 50 Series GPUs

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. NVIDIA recently announced a new generation of PC GPUs—the GeForce RTX 50 Series—alongside new AI-powered SDKs and tools for developers. Powered by the NVIDIA Blackwell architecture, fifth-generation Tensor Cores and fourth-generation RT Cores, the GeForce RTX 50 […]

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Vision Components Introduces MIPI Camera Modules with Integrated Image Pre-processing

Ettlingen, February 6, 2025.  Vision Components introduces VC MIPI Cameras with onboard image pre-processing at embedded world (March 11-13, 2025, Nuremberg). The tiny camera modules can detect and extract barcodes, objects, edges and laser lines as well as perform blob analyses and color conversions. VC will also show a new version of the FPGA accelerator

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Qualcomm AI Research Makes Diverse Datasets Available to Advance Machine Learning Research

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Qualcomm AI Research has published a variety of datasets for research use. These datasets can be used to train models in the kinds of applications most common to mobile computing, including: advanced driver assistance systems (ADAS), extended reality

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Make Your Existing NVIDIA Jetson Orin Devices Faster with Super Mode

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. The NVIDIA Jetson Orin Nano Super Developer Kit, with its compact size and high-performance computing capabilities, is redefining generative AI for small edge devices. NVIDIA has dropped an exciting new update to their existing Jetson

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Advanced Packaging: How AI is Revolutionizing the Game

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The growth of the AI server market is driving the adoption of 2.5D/3D packaging technologies. 2.5D & 3D interconnect types for the high-end performance packaging market: Revenue is expected to grow with

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STMicroelectronics and HighTec EDV-Systeme Collaborate for Safer Software-defined Vehicles

Where safety meets safety: ST’s Stellar MCUs certified to the highest level of risk management, ISO 26262 ASIL D, are now supported with the same safety level by HighTec’s Rust compiler Geneva, Switzerland and Saarbrücken, Germany, February 4, 2025 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications,

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Empowering Civil Construction with AI-driven Spatial Perception

This blog post was originally published at Au-Zone Technologies’ website. It is reprinted here with the permission of Au-Zone Technologies. Transforming Safety, Efficiency, and Automation in Construction Ecosystems In the rapidly evolving field of civil construction, AI-based spatial perception technologies are reshaping the way machinery operates in dynamic and unpredictable environments. These systems enable advanced

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Can Money Buy AI Dominance?

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The announcements of the creation of Stargate last week as well as the revelation of DeepSeek-V3’s performance at a much lower cost than OpenAI and its competitors are both raising a lot

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AI Chips Take Center Stage at CES

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The 2025 edition of the world’s largest consumer electronics conference showcased the latest semiconductors for artificial intelligence applications The CES 2025 conference in Las Vegas showcased the latest semiconductor innovations, offering some

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Which AI Hardware Will Rise Above in the Wake of Competing AI Models?

IDTechEx forecasts for yearly unit sales of HPC and AI GPUs and CPUs between 2024 and 2035. The grip of AI has continued to hold, with strong competition to develop more powerful AI models, active innovation in the semiconductor industry, and continued investment in the High-Performance Computing (HPC) data center market. Artificial Intelligence has been

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