Processors

STMicroelectronics Demonstration of a Smart 0.6 Mpixel Global Shutter Image Sensor for MCU Offload

Ruchi Upadhyay, Technical Marketing Manager at STMicroelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Upadhyay demonstrates STMicroelectronics’ new 0.6M pixel global shutter smart image sensor, capable of offloading some MCU workloads. The sensor features intelligence on-chip to deliver 3 key features: autonomous wake up […]

STMicroelectronics Demonstration of a Smart 0.6 Mpixel Global Shutter Image Sensor for MCU Offload Read More +

AI Chips for Edge Applications 2024-2034: Artificial Intelligence at the Edge

For more information, visit https://www.idtechex.com/en/research-report/ai-chips-for-edge-applications-2024-2034-artificial-intelligence-at-the-edge/956. The global AI chips market for edge devices will grow to US$22.0 billion by 2034, with the three largest industry verticals at that time being Consumer Electronics, Industrial, and Automotive. Artificial Intelligence (AI) is already displaying significant transformative potential across a number of different applications, from fraud detection in high-frequency

AI Chips for Edge Applications 2024-2034: Artificial Intelligence at the Edge Read More +

Innowave Demonstration of Complete Vision Camera Solutions Using NXP’s i.MX 8M Plus SoC with Integrated ISP

Miki Peer, founder and CEO of Innowave, demonstrates the company’s latest edge AI and vision technologies and products in NXP Semiconductors’ booth at the 2023 Embedded Vision Summit. Specifically, Peer demonstrates camera module integration using NXP’s i.MX 8M Plus SoC along with a Sony IMX258 13 Mpixel image sensor. Innowave calibrated and tuned the integrated

Innowave Demonstration of Complete Vision Camera Solutions Using NXP’s i.MX 8M Plus SoC with Integrated ISP Read More +

NXP Demonstration of AI Functions Implemented on Low-power MCX and RT Microcontrollers

Anthony Huereca, Systems Engineer at NXP Semiconductors, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Huereca demonstrates AI functions running on NXP’s low-power microcontrollers (MCUs). NXP’s new MCX N MCU, which includes the NXP-developed eIQ Neutron NPU, delivers an approximately 40x inference performance improvement when

NXP Demonstration of AI Functions Implemented on Low-power MCX and RT Microcontrollers Read More +

The M2 Pro SoC, Apple’s Path of Innovative Advancements

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole SystemPlus analyzes the M2 Pro System-on-Chip, with insights into the technology advances, manufacturing, packaging and consumer price of Apple’s upgraded, second-generation silicon. OUTLINE The M2 series uses the next-generation Avalanche and

The M2 Pro SoC, Apple’s Path of Innovative Advancements Read More +

NXP Demonstration of a Driver Monitoring System Enabled By the i.MX 93 SoC and Its Integrated NPU

Michael Pontikes, Systems Engineer at NXP Semiconductors, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Pontikes demonstrates unique features of the new i.MX 93 applications processor. This latest processor from NXP Semiconductors, continuing the company’s long legacy of i.MX applications processors, features the Arm Ethos

NXP Demonstration of a Driver Monitoring System Enabled By the i.MX 93 SoC and Its Integrated NPU Read More +

5 Benefits of On-device Generative AI

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. On-device AI processing offers must-have benefits for privacy, performance, personalization, cost, and energy In the mid-’90s, the World Wide Web ushered in the era of massive remote data center computing now known as the cloud. And this

5 Benefits of On-device Generative AI Read More +

Generative AI Trends by the Numbers: Costs, Resources, Parameters and More

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. We did the math: And here’s the cost of today’s AI Big Bang As indicated in our whitepaper, The Future of AI is Hybrid (part 1): Unlocking the generative AI future  with on-device and hybrid AI, a

Generative AI Trends by the Numbers: Costs, Resources, Parameters and More Read More +

Machine Learning Transforms the Internet of Things

This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. The integration of ML into IoT is sparking exponential growth and shaping a dynamic ecosystem The pace of Internet of Things (IoT) innovation has quickened in recent years, but it’s now being kicked into hyper drive. The

Machine Learning Transforms the Internet of Things Read More +

Nextchip Demonstration of RCCG-based Image Sensor Operation with APACHE_U, Its Newest ISP

Young-Jun Yoo, Vice President of the Automotive Business Unit at Nextchip, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Yoo demonstrates using a RCCG filter array-based image sensor with APACHE_U, Nextchip’s newest image signal processor (ISP). APACHE_U is an 8 Mpixel ISP for ADAS cameras.

Nextchip Demonstration of RCCG-based Image Sensor Operation with APACHE_U, Its Newest ISP Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top