Processors

SoC Market Forecasted to Grow to $250B by 2027

Market Analysis, Processors /

For more information, visit https://semico.com/content/system-chip-market-analysis-and-methodology. Design cycle times have lengthened, product life cycles have become shorter, consumer-driven applications and competition among chip and OEM manufacturers drives the use of SoCs. It is estimated that the time to design complex SoC silicon is twelve to sixteen months, and a typical product life cycle is less than twelve […]

SoC Market Forecasted to Grow to $250B by 2027 Read More +

“Tensilica Processor Cores Enable Sensor Fusion for Robust Perception,” a Presentation from Cadence

Algorithms, Cadence, Processors, Sensors and Cameras, Software, Summit 2023, Tools, Videos /

Amol Borkar, Product Marketing Director at Cadence, presents the “Tensilica Processor Cores Enable Sensor Fusion for Robust Perception” tutorial at the May 2023 Embedded Vision Summit. Until recently, the majority of sensor-based AI processing used vision and speech inputs. Recently, we have begun to see radar, LiDAR, event-based image sensors and other types of sensors

“Tensilica Processor Cores Enable Sensor Fusion for Robust Perception,” a Presentation from Cadence Read More +

BrainChip Demonstrates Akida Edge AI/ML at tinyML EMEA Innovation Forum in Amsterdam

BrainChip, News, Processors, Tools /

Laguna Hills, Calif. – June 22, 2023 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, will demonstrate the capabilities of its Akida™ neuromorphic computing platform to attendees of the tinyML EMEA Innovation Forum, June 26-28 in Amsterdam. Brainchip will

BrainChip Demonstrates Akida Edge AI/ML at tinyML EMEA Innovation Forum in Amsterdam Read More +

“Enabling Ultra-low Power Edge Inference and On-device Learning with Akida,” a Presentation from BrainChip

Algorithms, BrainChip, Processors, Software, Summit 2023, Tools, Videos /

Nandan Nayampally, Chief Marketing Officer at BrainChip, presents the “Enabling Ultra-low Power Edge Inference and On-device Learning with Akida” tutorial at the May 2023 Embedded Vision Summit. The AIoT industry is expected to reach $1T by 2030—but that will happen only if edge devices rapidly become more intelligent. In this presentation, Nayampally shows how BrainChip’s

“Enabling Ultra-low Power Edge Inference and On-device Learning with Akida,” a Presentation from BrainChip Read More +

Qualcomm at CVPR 2023: Advancing Research and Bringing Generative AI to the Edge

Algorithms, Blog Posts, Processors, Qualcomm, Sensors and Cameras, Software, Tools /

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. ControlNet running entirely on device, fitness coaching with an LLM, 3D reconstruction for XR, our accepted papers and much more The annual IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) is regarded as one of the

Qualcomm at CVPR 2023: Advancing Research and Bringing Generative AI to the Edge Read More +

“Battery-powered Edge AI Sensing: A Case Study Implementing Low-power, Always-on Capability,” a Presentation from Avnet

Algorithms, Avnet, Processors, Sensors and Cameras, Software, Summit 2023, Tools, Videos /

Peter Fenn, Director of the Advanced Applications Group at Avnet, presents the “Battery-powered Edge AI Sensing: A Case Study Implementing Low-power, Always-on Capability” tutorial at the May 2023 Embedded Vision Summit. The trend of pushing AI/ML capabilities to the edge brings design challenges around the need to combine high-performance computing (for AI/ML algorithms) with low

“Battery-powered Edge AI Sensing: A Case Study Implementing Low-power, Always-on Capability,” a Presentation from Avnet Read More +

“Sparking the Next Generation of Arm-based Cloud-native Smart Camera Designs,” a Presentation from Arm

Algorithms, Arm, Processors, Security, Sensors and Cameras, Software, Summit 2023, Tools, Videos /

Stephen Su, Senior Product Manager at Arm, presents the “Sparking the Next Generation of Arm-based Cloud-native Smart Camera Designs” tutorial at the May 2023 Embedded Vision Summit. As enterprises and consumers increasingly adopt machine learning-enabled smart cameras, the expectations of these end users are becoming more sophisticated. In particular, smart camera users increasingly expect their

“Sparking the Next Generation of Arm-based Cloud-native Smart Camera Designs,” a Presentation from Arm Read More +

“Processing Raw Images Efficiently on the MAX78000 Neural Network Accelerator,” a Presentation from Analog Devices

Algorithms, Analog Devices, Processors, Software, Summit 2023, Tools, Videos /

Gorkem Ulkar, Principal ML Engineer at Analog Devices, presents the “Processing Raw Images Efficiently on the MAX78000 Neural Network Accelerator” tutorial at the May 2023 Embedded Vision Summit. In this talk, Ulkar presents alternative and more efficient methods of processing raw camera images using neural network accelerators. He begins by introducing Analog Devices’ convolutional neural

“Processing Raw Images Efficiently on the MAX78000 Neural Network Accelerator,” a Presentation from Analog Devices Read More +

Innovation Beyond Moore’s Law: Advanced Packaging Explores New Frontiers

Market Analysis, Processors, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. ECTC explores integration, bonding technologies and new materials in search of advanced packaging for the AI age Advanced packaging is a linchpin for the semiconductor industry which is wrestling with integrating multiple

Innovation Beyond Moore’s Law: Advanced Packaging Explores New Frontiers Read More +

Advanced Semiconductor Packaging: A New Geopolitical Battleground

Market Analysis, Processors, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Geopolitical tensions are making advanced semiconductor packaging increasingly crucial… OUTLINE The Advanced Packaging (AP) market, valued at US$44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022

Advanced Semiconductor Packaging: A New Geopolitical Battleground Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Pages

Topics

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top