November 18, 2020 – Vision Components presents various new camera modules that combine high image quality and frame rates with the advantages of the MIPI CSI-2 interface and consist of the sensor board and a fully integrated MIPI adapter board. Thereby high-end image sensors from the Sony Pregius and Sony Starvis series, which have no […]
New High-end Sensors with MIPI Interface Read More +
The solution enables industrial-equipment vendors to quickly evaluate Octonion’s embedded AI models, running on-device learning directly on STM32 MCUs Lausanne and Geneva, Switzerland – November 18, 2020 — Octonion SA, a deep tech software company specializing in Artificial Intelligence (AI) at the Edge for industrial-equipment diagnosis, announced an STM32Cube expansion package optimized for STM32L4+ microcontroller-based
OUTLINE: T3S thermal camera from IRAY – Details: Pixel resolution: 384×288 – Pixel pitch: 17µm – Thermal resolution: <60mK – Temperature measurement accuracy: +/-3% Those specifications have been tested in Piséo’s report. Evaluation from Piséo: Good value-for-money product but it requires some improvements. Good image quality provided thanks to a very good bolometric sensor. IRAY’s
T3S Thermal Camera from IRAY Technology: a Good Value-for-Money Product, but… Read More +
Combined with Portfolio of Medical CameraCubeChip™ Modules and OVMed ISP Boards, New Line of Cables Enables OmniVision to Uniquely Provide Optimally Tuned End-to-End Imaging Subsystems SANTA CLARA, Calif. – Nov. 16, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced at CompaMed the OVMed® Cable line of medical endoscope,
Joint Solution Combines OmniVision’s Wafer-Level CameraCubeChip™ Technology With Almalence’s Unique SuperResolution Algorithm to Provide Highest Quality Images of Smallest Parts of Anatomy SANTA CLARA, Calif. – Nov. 16, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, and Almalence Inc., one of the world’s leaders in computational imaging, today announced at
The VCSEL industry has witnessed strong growth in the past few years, since the emergence of 3D sensing in smartphones. According to Yole Développement’s latest report “VCSELs – Market and Technology Trends 2020“, the VCSEL market for mobile and consumer applications is expected to grow from $844M in 2020 to $2.1B in 2025, representing a
OUTLINE: Market figures & trends: Yole Développement (Yole) envisions a growing future for the CIS industry at 5.7% CAGR. This growth is showing tighter links to the growth of semiconductor in general. Mobile keeps the most important role for CIS. In parallel, security and automotive have emerged. The impact of the Huawei ban has been
CIS Represents 5.1% of Global Semiconductor Sales in 2021. What is Next? Read More +
Reference Design Combines OmniVision’s Dual-Mode Global Shutter Image Sensor for Both RGB and IR Imaging With Ambarella’s AI Vision Processor and Smart Eye’s AI DMS Software Algorithm SANTA CLARA, Calif. – Nov. 10, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, Ambarella, Inc. (Nasdaq: AMBA), an AI vision silicon company,
November 9, 2020 – FRAMOS‘s SLVS-EC RX IP Core Development Kit comes with comprehensive support for those looking to connect with sensors using the SLVS-EC interface. This new, scalable, 2.0 version SLVS-EC high-speed interface supports a higher data rate for all 8 lanes at 5 Gbps throughput per lane, up from the previous 2.5Gbps speeds.
Simplifying Designs with FRAMOS IP Core for SLVS-EC v2.0 Read More +
This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. The next generation of access control is being shaped by both security and health concerns. Ensuring safe access to buildings and rooms has arguably never been more critical. Or, unfortunately, more complex. What was once purely a
A New Wave of Touchless Access Read More +
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