Sensors and Cameras

Metalenz and STMicroelectronics Deliver World’s First Optical Metasurface Technology for Consumer Electronics Devices

Metalenz metasurfaces are now on the market through its partnership with STMicroelectronics, marking the introduction of this revolutionary optical technology in real-world devices 09 Jun 2022 | Boston, MA and Geneva, Switzerland | Metalenz, the first company to commercialize meta-optics, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics […]

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2nd-generation Multi-zone Direct Time-of-flight Sensor from STMicroelectronics Uses Less Energy and Can Range 2X as Far as Existing Products

The VL53L8 direct Time-of-Flight (dToF) sensor is ideal for smartphones as well as smart speakers, human-machine interfaces, consumer LiDAR, and AR/VR/MR Sensor combines new revolutionary metasurface lens technology with a more powerful and efficient laser and improved on-chip processing 09 Jun 2022 | Geneva | STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across

2nd-generation Multi-zone Direct Time-of-flight Sensor from STMicroelectronics Uses Less Energy and Can Range 2X as Far as Existing Products Read More +

Basler pylon vTools: Custom-Fit Image Processing Modules for the New pylon 7

With the release of pylon 7, Basler is expanding its popular software to include pylon vTools. With these software modules, Basler customers can use a range of intelligent image processing functions for their applications without extensive training. Ahrensburg, June 09, 2022 – With the release of pylon 7, Basler AG introduces a series of software

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CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

FSP201 delivers superior orientation and heading accuracy, providing high quality, low cost, sensor-agnostic solution for robotics, 3D audio, metaverse hardware & general 6-axis motion applications ROCKVILLE, MD, June 09, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity, smart sensing technologies, and integrated IP solutions, today announced that it has expanded its

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection Read More +

“Powering the Connected Intelligent Edge and the Future of On-Device AI,” a Presentation from Qualcomm

Ziad Asghar, Vice President of Product Management at Qualcomm, presents the “Powering the Connected Intelligent Edge and the Future of On-Device AI” tutorial at the May 2022 Embedded Vision Summit. Qualcomm is leading the realization of the “connected intelligent edge,” where the convergence of wireless connectivity, efficient computing and distributed AI will power the devices

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Now Available: Teledyne FLIR 2022 Mono and Color Sensor Reviews

Today, we have more choice than ever when it comes to machine vision camera sensors and models. Beyond, megapixels and speed, a good place start narrowing down camera choices is with EMVA 1288 information. These specifications allow the comparison of the image quality of cameras and sensors such as read noise or how well they

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STMicroelectronics Releases First Automotive IMU with Embedded Machine Learning

May 24, 2020 – STMicroelectronics’ ASM330LHHX inertial measurement unit (IMU) moves smart driving another step closer to high levels of automation with its machine-learning (ML) core. The ML core enables fast real-time response and sophisticated functions with low system power demand. Leveraging ST’s micro-electro-mechanical systems (MEMS) technology, the automotive-qualified ASM330LHHX houses a 3-axis accelerometer and

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e-con Systems Launches a Time of Flight (ToF) Camera for Accurate 3D Depth Measurement

Depth & RGB in single frame | 640×480 depth map | Frame rate – 30 fps | USB 3.1 Gen 1| Low light San Jose and Chennai (May 17, 2022) – e-con Systems™, a leading embedded camera company, launches DepthVista – a Time of Flight (ToF) camera that comes with a combination of a ToF

e-con Systems Launches a Time of Flight (ToF) Camera for Accurate 3D Depth Measurement Read More +

Teledyne to Present Advanced Industrial and Scientific Imaging Technology at Automate 2022

Waterloo, Ontario, May 24, 2022 – Teledyne will display their newest products and solutions at Automate 2022 exhibition taking place June 6-9, in Detroit, Michigan. Teledyne will be showcasing the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Whether you’re designing systems for food processing or semiconductor inspection, developing the next

Teledyne to Present Advanced Industrial and Scientific Imaging Technology at Automate 2022 Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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