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Flex Logix Overview of How to Enable Long-lasting Security For SoCs with Embedded FPGA Technology

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Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Bethurem discusses how his company’s embedded FPGA technology can enable long-lasting security for SoCs. Considering current and future security landscapes and their associated challenges, providing […]

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DEEPX Demonstration of Its DX-M1 AIoT Booster

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Taisik Won, the President of DEEPX USA, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Won demonstrates the company’s AIoT Booster, the DX-M1. The DX-M1 is DEEPX’s flagship AI chip, meticulously engineered for seamless integration into any AIoT application. This cutting-edge chip can simultaneously process

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DEEPX Demonstration of Its DX-V1 and DX-V3 AI Vision Processors

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Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s DX-V1 and DX-V3 AI vision processors. The DX-V1 and DX-V3 are AI enabler chips for vision systems. The DX-V1 is a standalone edge AI chip that can

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Free Webinar Explores Processor Evaluation and Selection

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On August 22, 2024 at 9 am PT (noon ET), Phil Lapsley, Co-Founder and Vice President of BDTI, will present the free hour webinar “Silicon Slip-Ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page:

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What’s Next in On-device Generative AI?

Algorithms, Blog Posts, Multimodal, Processors, Qualcomm, Software, Tools /

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Upcoming generative AI trends and Qualcomm Technologies’ role in enabling the next wave of innovation on-device The generative artificial intelligence (AI) era has begun. Generative AI innovations continue at a rapid pace and are being woven into

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DEEPX Demonstration of Its DX-H1 Green AI Computing Card

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Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s latest innovation, the DX-H1 Green AI Computing Card. The DX-H1 is designed for eco-friendly data centers, delivering 10 times better power and cost efficiency than GPGPU solutions.

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Cadence Demonstration of a Large Vision Model for Generative AI on the Tensilica Vision P6 DSP

Algorithms, Cadence, Object Identification, Object Tracking, Processors, Software, Summit 2024, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision P6 DSP for the latest generative AI (GenAI) applications. The Vision P6 DSP is a

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Cadence Demonstration of Time-of-Flight Decoding on the Tensilica Vision Q7 DSP

Algorithms, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision Q7 DSP for Time-of-Flight (ToF) decoding. In this demonstration, the Tensilica Vision Q7 DSP integrated

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Cadence Demonstration of an Imaging Radar Applications on the Tensilica ConnX B10 DSP

Algorithms, Automotive, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica ConnX B10 DSP for automotive imaging radar applications. The ConnX B10 DSP is a highly efficient,

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Quadric’s 3rd Generation Chimera GPNPU Product Family Expands to 864 TOPs, Adds Automotive-grade Safety Enhanced Versions

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Chimera QC Series GPNPUs add more configurability, scales single cores to over 100 TOPs New multicore cluster QC-M family scales up to 864 TOPs Compute density increases TOPs/mm2 up to 2.7X greater than previous generation Adds floating point and 4-bit weight support Safety Enhanced Versions add ASIL-B/D compatible versions for automotive designs Burlingame, CA – July

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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