eYs3D Microelectronics Corp. is a silicon-centric and AI-enabling solutions provider specializing in computer vision and 3D sensor fusion processing for applications such as AIoT, robotics and VR/AR systems. Arm, WI Harper Group and other semiconductor synergistic aligned investors have recently endorsed eYs3D both financially and also via collaboration in future projects. eYs3D continues to innovate in 3D sensing technologies by fusing state-of-the-art algorithms such as stereoscopic and structure-light hybrid depth, point-cloud compression, and AI post-processing on Arm’s CPU/NPU computing cores and in high-performance 28nm and 12nm process technologies. eYs3D provides all levels of silicon-based integration services for computer vision applications. eYs3D also offers a variety of ready-to-use high-precision and wide field-of-view (FoV) stereo depth cameras. The cameras are equipped with dual sensors for various-resolution RGB and depth map outputs over USB, making the products ideal for 3D sensing and scene learning development.
eYs3D Microelectronics
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Alliance Members at 2025 CES
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eYs3D Microelectronics Demonstration of Computer Vision Embedded Solutions with an AI SoC
James Wang, president of eYs3D Microelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the September 2024 Edge AI and Vision Alliance Forum. Specifically, Wang demonstrates the company’s stereo camera and AI SoC with edge processing capability, and computer vision object detection models.
eYs3D Microelectronics Unveils the Multi-camera Sensing System, SenseLink, Providing a Versatile Machine Vision Sensing Solution for Smart Applications
May 30, 2024 – eYs3D Microelectronics, with years of expertise in the fields of 3D sensing and computer vision, is a subsidiary of Etron Tech (TPEx: 5351). It has recently launched SenseLink, a multi-camera sensing system chip designed to enhance visual AI sensing capabilities. This technology utilizes advanced sensor fusion techniques to integrate data from […]
CES 2024: eYs3D’s New Edge AI Chips Transforming Computer Vision for Robotics
New AI-dedicated eCV series SoCs with ARM-based CPUs elevate AI capabilities for advanced autonomous robots, smart home, and industrial IoT solutions; launch is key milestones for brand as it embraces “AI+” concept and expands offering LAS VEGAS, Nev. and TAIPEI, Jan. 5, 2024 /PRNewswire/ — Known as a leader in 3D sensing and computer vision semiconductors under […]
eYs3D Launches One-stop XINK Development Platform for Vision-equipped Robots
The Platform-as-a-Service Uses SoM (System on Module) with the New 4 Multi-Core ARM CPU and 4.6 TOPS AI Data Processor to Speed Design LAS VEGAS and TAIPEI, Taiwan, Jan. 3, 2023 /PRNewswire/ — eYs3D Microelectronics, a subsidiary of Etron Technology (TPEx: 5351. TW), a subsidiary of Etron Technology (TPEx: 5351. TW), launched at CES a state-of-the-art computer vision development […]
STMicroelectronics and eYs3D Microelectronics to Showcase Collaboration on High-quality 3D Stereo-vision Camera for Machine Vision and Robotics at CES 2023
Companies will demonstrate 3D depth vision through stereo cameras fusion for fast-motion object tracking in AIoT and autonomous guided robots and industrial devices Reference designs leverage ST’s high-performance, near-infrared, global-shutter image sensors to ensure best quality depth sensing and point-cloud creation 02 Jan 2023 | Geneva, Switzerland, and Taipei, Taiwan | STMicroelectronics (NYSE: STM), a […]
eYs3D Microelectronics Demonstration of Stereo Vision for Robotic Automation and Depth Sensor Fusion
James Wang, Technical General Manager at eYs3D Microelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Wang demonstrates stereo vision for robotic automation and depth sensor fusion. Depth-sensing technology is now being widely adopted commercially in various consumer and industrial products. It’s commonly recognized that […]
eCapture from eYs3D Microelectronics Launches Smallest Form Factor 3D Stereo Depth Sensing Camera for Robotics and Object Tracking
eCapture™️ Cameras leverage eYs3D stereo vision technology and high-performance vision processor in this new line of devices SANTA CLARA, CA / ACCESSWIRE / August 23, 2021 / eCapture, a brand focused on developing technology for the growing computer vision market, today is introducing the smallest form factor stereoscopic 3D depth sensing camera. The new LifeSense™ […]
Blaize and eYs3D Microelectronics Unveil New Reference Design for Enhanced 3D Computer Vision for Edge AI
El Dorado Hills, CA — June 28, 2021 — Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, and eYs3D Microelectronics, the image processor solution provider enabling enhanced 3D computer vision for edge AI, today announced a reference design for the Blaize Pathfinder P1600 SoM (system on a module). The Blaize Pathfinder P1600 […]
