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FRAMOS

ImagingNext 2025 Inspires the AI Vision Community: Exciting Insights, Powerful Keynote Speeches, and Valuable Contacts

Munich, Bavaria, Germany – September 25th, 2025 – This year’s ImagingNext, the leading event for AI vision and embedded imaging, was a resounding success. Around 100 participants came together to discuss the latest trends, technologies, and use cases in the field of vision AI in an inspiring atmosphere. The mood was great – from the

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Blog Posts

Introducing Modalix SoM: Power Efficient SoM with Rich Peripherals for Seamless Sensor Integration

This blog post was originally published at SiMa.ai’s website. It is reprinted here with the permission of SiMa.ai. At SiMa.ai, we’re pushing the boundaries of what’s possible with Physical AI. Today, we’re proud to announce the sampling of our new System-on-Module (SoM), featuring the second-generation Modalix™ MLSoC. Designed to bring cutting-edge GenAI and LLM capabilities

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News

New Snapdragon X2 Elite Extreme and Snapdragon X2 Elite are the Fastest and Most Efficient Processors for Windows PCs

Highlights: Built for ultra-premium Windows 11 PCs, Snapdragon® X2 Elite Extreme tackles complex, expert-level workloads with ultimate performance, multi-day battery life and blazing fast AI-processing power. Snapdragon® X2 Elite drives powerful and efficient multitasking across resource-intensive workloads in premium Windows 11 PCs, with industry-leading performance that can last for days. These next-generation premium-tier platforms within

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Market Analysis

Market Analysis

Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging

The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036. In this new article, IDTechEx Senior Technology

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Market Analysis

IDTechEx Technology Innovations Outlook 2026-2036

This collection of in-depth articles from IDTechEx industry experts examines some of the most important technology innovation trends set to transform global industries over the next decade. It provides both a clear assessment of today’s landscape and a forward-looking outlook through to 2036, helping businesses, investors, and policymakers prepare for opportunities and challenges ahead. This

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Automotive

Semiconductors at the Heart of Automotive’s Next Chapter

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Automotive White Paper, Vol.2, Powered by Yole Group – Shifting gears! KEY TAKEAWAYS The automotive semiconductor market will soar from $68 billion in 2024 to $132 billion in 2030, growing at a

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Blog

Blog Posts

Introducing Modalix SoM: Power Efficient SoM with Rich Peripherals for Seamless Sensor Integration

This blog post was originally published at SiMa.ai’s website. It is reprinted here with the permission of SiMa.ai. At SiMa.ai, we’re pushing the boundaries of what’s possible with Physical AI. Today, we’re proud to announce the sampling of our new System-on-Module (SoM), featuring the second-generation Modalix™ MLSoC. Designed to bring cutting-edge GenAI and LLM capabilities

Read More »
Algorithms

The Edge’s Essential Role in the Future of AI

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. What you should know: The future of AI will be hybrid, with the cloud and the edge working together — each playing a vital role. The user interface (UI) is now human-centric — your device understands your

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