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Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging
The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability,

IDTechEx Technology Innovations Outlook 2026-2036
This collection of in-depth articles from IDTechEx industry experts examines some of the most important technology innovation trends set to

ImagingNext 2025 Inspires the AI Vision Community: Exciting Insights, Powerful Keynote Speeches, and Valuable Contacts
Munich, Bavaria, Germany – September 25th, 2025 – This year’s ImagingNext, the leading event for AI vision and embedded imaging,

Introducing Modalix SoM: Power Efficient SoM with Rich Peripherals for Seamless Sensor Integration
This blog post was originally published at SiMa.ai’s website. It is reprinted here with the permission of SiMa.ai. At SiMa.ai,

The Edge’s Essential Role in the Future of AI
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. What you

New Snapdragon X2 Elite Extreme and Snapdragon X2 Elite are the Fastest and Most Efficient Processors for Windows PCs
Highlights: Built for ultra-premium Windows 11 PCs, Snapdragon® X2 Elite Extreme tackles complex, expert-level workloads with ultimate performance, multi-day battery

Snapdragon 8 Elite Gen 5, the World’s Fastest Mobile System-on-a-chip, Establishes New Consumer Experiences and Sets New Industry Benchmarks
Highlights: The 3rd Gen Qualcomm Oryon™ CPU is the fastest mobile CPU ever. With state-of-the-art performance, efficiency and on-device AI

How e-con Systems Built a Multi-camera Solution for Large Mining Vehicles to Eliminate Blind Spots
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems.

Semiconductors at the Heart of Automotive’s Next Chapter
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of
News

ImagingNext 2025 Inspires the AI Vision Community: Exciting Insights, Powerful Keynote Speeches, and Valuable Contacts
Munich, Bavaria, Germany – September 25th, 2025 – This year’s ImagingNext, the leading event for AI vision and embedded imaging, was a resounding success. Around 100 participants came together to discuss the latest trends, technologies, and use cases in the field of vision AI in an inspiring atmosphere. The mood was great – from the

Introducing Modalix SoM: Power Efficient SoM with Rich Peripherals for Seamless Sensor Integration
This blog post was originally published at SiMa.ai’s website. It is reprinted here with the permission of SiMa.ai. At SiMa.ai, we’re pushing the boundaries of what’s possible with Physical AI. Today, we’re proud to announce the sampling of our new System-on-Module (SoM), featuring the second-generation Modalix™ MLSoC. Designed to bring cutting-edge GenAI and LLM capabilities

New Snapdragon X2 Elite Extreme and Snapdragon X2 Elite are the Fastest and Most Efficient Processors for Windows PCs
Highlights: Built for ultra-premium Windows 11 PCs, Snapdragon® X2 Elite Extreme tackles complex, expert-level workloads with ultimate performance, multi-day battery life and blazing fast AI-processing power. Snapdragon® X2 Elite drives powerful and efficient multitasking across resource-intensive workloads in premium Windows 11 PCs, with industry-leading performance that can last for days. These next-generation premium-tier platforms within
Market Analysis

Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging
The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036. In this new article, IDTechEx Senior Technology

IDTechEx Technology Innovations Outlook 2026-2036
This collection of in-depth articles from IDTechEx industry experts examines some of the most important technology innovation trends set to transform global industries over the next decade. It provides both a clear assessment of today’s landscape and a forward-looking outlook through to 2036, helping businesses, investors, and policymakers prepare for opportunities and challenges ahead. This

Semiconductors at the Heart of Automotive’s Next Chapter
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Automotive White Paper, Vol.2, Powered by Yole Group – Shifting gears! KEY TAKEAWAYS The automotive semiconductor market will soar from $68 billion in 2024 to $132 billion in 2030, growing at a
Blog

Introducing Modalix SoM: Power Efficient SoM with Rich Peripherals for Seamless Sensor Integration
This blog post was originally published at SiMa.ai’s website. It is reprinted here with the permission of SiMa.ai. At SiMa.ai, we’re pushing the boundaries of what’s possible with Physical AI. Today, we’re proud to announce the sampling of our new System-on-Module (SoM), featuring the second-generation Modalix™ MLSoC. Designed to bring cutting-edge GenAI and LLM capabilities

The Edge’s Essential Role in the Future of AI
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. What you should know: The future of AI will be hybrid, with the cloud and the edge working together — each playing a vital role. The user interface (UI) is now human-centric — your device understands your

How e-con Systems Built a Multi-camera Solution for Large Mining Vehicles to Eliminate Blind Spots
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Large mining vehicles tend to operate in unpredictable terrains. They often face issues like poor lighting or heavy dust. Find out how e-con Systems helped a client select and deploy a multi-camera solution for their