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D3 Embedded Partners with Silicon Highway to Provide Rugged Camera Solutions to Europe
Rochester, NY – February 12, 2025 – D3 Embedded today announced its partnership with Silicon Highway, a leading European distribution

Intel Unveils Leadership AI and Networking Solutions with Xeon 6 Processors
Intel completes Xeon 6 portfolio of processors, delivering a CPU for the broadest set of workloads in the industry. NEWS

Nota AI Supports Qualcomm AI Hub with On-device Generative AI, Proving Global Technological Prowess
The on-device generative AI optimization platform NetsPresso® supports AI model optimization on Qualcomm processors through the Qualcomm AI Hub Earns

Detailed Imaging and Pixel-level Accuracy with Emerging Image Sensors
A graph showing the importance of hyperspectral imaging qualities by sector. Emerging image sensors are being developed with capabilities beyond

STMicroelectronics Reveals Advanced 2-in-1 MEMS Accelerometer in One IMU for Intensive Impact Sensing in Wearables and Trackers
16g/80g dual-range IMU with edge processing brings advanced sports monitoring to affordable wearables to “train like a pro!” Geneva, Switzerland,

The Intersection of AI and Human Expertise: How Custom Solutions Enhance Collaboration
This blog post was originally published at Digica’s website. It is reprinted here with the permission of Digica. Artificial Intelligence-based

Top-tier ADAS Systems: Exploring Automotive Radar Technology
Radars have had a place within the automotive sector for over two decades, beginning with the first use for adaptive

SAM 2 + GPT-4o: Cascading Foundation Models via Visual Prompting (Part 1)
This article was originally published at Tenyks’ website. It is reprinted here with the permission of Tenyks. In Part 1

Vision Components and Phytec Announce Partnership: MIPI Cameras and Processor Boards Perfectly Integrated
Mainz, February 20, 2025 – Phytec and Vision Components have agreed to collaborate on the integration of cameras into embedded
News

AMD Unveils Next-generation AMD RDNA 4 Architecture with the Launch of AMD Radeon RX 9000 Series Graphics Cards
The new AMD Radeon™ RX 9000 Series graphics cards deliver enthusiast-level gaming experiences supercharged by AI SANTA CLARA, Calif., Feb. 28, 2025 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today unveiled the highly-anticipated AMD RDNA™ 4 graphics architecture with the launch of the AMD Radeon™ RX 9070 XT and RX 9070 graphics cards as a part

Arm Drives Next-generation Performance for IoT with World’s First Armv9 Edge AI Platform
News highlights: World’s first Armv9 edge AI platform, optimized for IoT with the new Cortex-A320 CPU and Ethos-U85 NPU, enables on-device AI models over one billion parameters – earning support from industry leaders, including AWS, Siemens and Renesas. The ultra-efficient Arm Cortex-A320 leverages Armv9 to enhance efficiency, performance, and security in IoT markets, driving advancements

e-con Systems Launches a Sony IMX900-based Global Shutter HDR USB Camera Powered by a High-performance TintE ISP
On-Camera HDR Excellence. Adapts to Any Light Any Motion. California & Chennai (Feb 25, 2025): e-con Systems®, a global leader in embedded vision solutions, is excited to unveil the latest innovation, See3CAM_37CUGM – a 3MP Global Shutter HDR Monochrome USB Camera. Powered by e-con’s high-performance TintE ISP and featuring the Sony® IMX900 sensor, this camera
Market Analysis

$1 Trillion by 2030: The Semiconductor Devices Industry is On Track
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Entering a new growth cycle, the surge in the semiconductor industry is driven by the rise of generative AI processors and HBM[1] OUTLINE Market evolution: with a $672 billion market in 2024[2],

Advanced Packaging: How AI is Revolutionizing the Game
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The growth of the AI server market is driving the adoption of 2.5D/3D packaging technologies. 2.5D & 3D interconnect types for the high-end performance packaging market: Revenue is expected to grow with

Can Money Buy AI Dominance?
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The announcements of the creation of Stargate last week as well as the revelation of DeepSeek-V3’s performance at a much lower cost than OpenAI and its competitors are both raising a lot
Blog

SAM 2 + GPT-4o: Cascading Foundation Models via Visual Prompting (Part 1)
This article was originally published at Tenyks’ website. It is reprinted here with the permission of Tenyks. In Part 1 of this article we introduce Segment Anything Model 2 (SAM 2). Then, we walk you through how you can set it up and run inference on your own video clips. Learn more about visual prompting

The Critical Role of FPGAs in Modern Embedded Vision Systems (Part 1)
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. FPGAs are rapidly becoming a best-fit solution for meeting the unique demands of high-performing embedded vision systems. Get insights into what FPGAs are, the challenges they solve, and how they offer unmatched benefits for interface

How to Keep Up with Artificial Intelligence: Navigating the Fast-paced World of AI
This blog post was originally published at Digica’s website. It is reprinted here with the permission of Digica. Artificial intelligence is one of the fastest-growing scientific fields ever, with an explosive rate of development that is reflected in both research and real-world applications. For example, the number of AI patents granted annually skyrocketed from just